Invention Grant
- Patent Title: Epitaxial channel
- Patent Title (中): 外延通道
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Application No.: US14208353Application Date: 2014-03-13
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Publication No.: US09525031B2Publication Date: 2016-12-20
- Inventor: Tsung-Hsing Yu , Ken-Ichi Goto , Chia-Wen Liu , Yeh Hsu
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Eschweiler & Associates, LLC
- Main IPC: H01L29/165
- IPC: H01L29/165 ; H01L29/10 ; H01L29/66 ; H01L29/78 ; H01L29/161 ; H01L21/02

Abstract:
Some embodiments of the present disclosure relate to an epitaxially grown replacement channel region within a transistor, which mitigates the variations within the channel of the transistor due to fluctuations in the manufacturing processes. The replacement channel region is formed by recessing source/drain and channel regions of the semiconductor substrate, and epitaxially growing a replacement channel region within the recess, which comprises epitaxially growing a lower epitaxial channel region over a bottom surface of the recess, and epitaxially growing an upper epitaxial channel region over a bottom surface of the recess. The lower epitaxial channel region retards dopant back diffusion from the upper epitaxial channel region, resulting in a steep retrograde dopant profile within the replacement channel region. The upper epitaxial channel region increases carrier mobility within the channel. The replacement channel region provides improved drive current, thereby enabling better performance and higher yield.
Public/Granted literature
- US20150263096A1 EPITAXIAL CHANNEL Public/Granted day:2015-09-17
Information query
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