Invention Grant
- Patent Title: Package structure and fabrication method thereof
- Patent Title (中): 封装结构及其制造方法
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Application No.: US14564180Application Date: 2014-12-09
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Publication No.: US09526171B2Publication Date: 2016-12-20
- Inventor: Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Hao-Ju Fang , Kuang-Neng Chung
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW103120464A 20140613
- Main IPC: H01L23/10
- IPC: H01L23/10 ; H05K1/11 ; H01L23/31 ; H01L21/56
Abstract:
A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.
Public/Granted literature
- US20150366085A1 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2015-12-17
Information query
IPC分类:
