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公开(公告)号：US10916838B2
公开(公告)日：2021-02-09
申请号：US14695469
申请日：2015-04-24
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chi-Liang Shih
Abstract: An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body. A portion of the antenna body is exposed from the encapsulant. As such, the invention increases the arrangement area of the antenna body without increasing the size of the substrate, and also reduces the height of the encapsulant. Therefore, the electronic module of the present invention meets the miniaturization requirement.
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公开(公告)号：US20170278807A1
公开(公告)日：2017-09-28
申请号：US15181489
申请日：2016-06-14
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chi-Pin Tsai , Chi-Liang Shih , Ming-Fan Tsai , Chia-Yang Chen
IPC: H01L23/66 , H01L23/31 , H01L23/498 , H01L23/00
CPC classification number: H01L23/66 , H01L23/3121 , H01L23/49838 , H01L24/48 , H01L24/49 , H01L2223/6611 , H01L2223/6677 , H01L2224/16225 , H01L2224/16227 , H01L2224/48091 , H01L2224/48101 , H01L2224/48106 , H01L2224/48195 , H01L2224/48225 , H01L2224/48227 , H01L2224/48265 , H01L2224/49171 , H01L2224/73253 , H01L2924/15192 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2924/19107
Abstract: Provided is an electronic package, including: a carrier, an electronic component disposed on the carrier, and an antenna structure, wherein the antenna structure has a plurality of spacing members and at least one wire connected among the spacing members. No additional layout area is required to be formed on a surface of the carrier, such that the objective of miniaturization can be achieved.
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公开(公告)号：US20170040304A1
公开(公告)日：2017-02-09
申请号：US14981479
申请日：2015-12-28
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Chun-Chong Chien , Hsin-Lung Chun , Te-Fang Chu
CPC classification number: H01L25/16 , H01L21/56 , H01L23/3121 , H01L23/49816 , H01L23/5383 , H01L23/552 , H01L25/50 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2224/81
Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.
Abstract translation: 提供电子封装，包括：具有相对的第一和第二表面的基板; 至少第一电子元件设置在所述基板的第一表面上; 封装所述第一电子元件的第一密封剂; 至少第二电子元件和设置在所述基板的第二表面上的框架; 以及封装所述第二电子元件的第二密封剂。 通过将第一和第二电子元件分别设置在基板的第一和第二表面上，本发明允许将所需数量的电子元件安装在基板上，而不需要增加基板的表面积。 由于电子封装的体积不增加，电子封装满足小型化要求。 本发明还提供一种制造电子封装的方法。
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公开(公告)号：US09343401B2
公开(公告)日：2016-05-17
申请号：US14256496
申请日：2014-04-18
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Sheng-Ming Yang , Hung-Cheng Chen , Chia-Yang Chen
CPC classification number: H01L23/49838 , H01L23/3128 , H01L23/49816 , H01L23/50 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/32268 , H01L2224/451 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/83191 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19105 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.
Abstract translation: 提供了一种制造半导体封装的方法，其包括以下步骤：提供具有多个焊盘和相对的第二表面的具有第一表面的封装基板; 在所述包装基板的第一表面上设置多个无源元件; 通过粘合膜将半导体芯片设置在无源元件上; 通过多个接合线电连接半导体芯片和接合焊盘; 以及在所述封装衬底的所述第一表面上形成密封剂以封装所述半导体芯片，所述无源元件和所述接合线。 通过在封装基板和半导体芯片之间配置无源元件，本发明节约了封装基板上的空间，增加了布线灵活性。 此外，由于接合线不容易与无源元件接触，所以本发明防止发生短路。
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公开(公告)号：US20150366085A1
公开(公告)日：2015-12-17
申请号：US14564180
申请日：2014-12-09
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Hao-Ju Fang , Kuang-Neng Chung
CPC classification number: H05K1/111 , H01L21/565 , H01L23/3128 , H01L23/58 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00014
Abstract: A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.
Abstract translation: 提供了一种封装结构，其包括：具有相对的第一和第二表面的基板; 至少设置在所述基板的第一表面上的电子元件; 以及形成在所述基板的所述第一表面上以封装所述电子元件的密封剂。 密封剂具有非矩形形状，以减少密封剂中的无效空间。
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Patent Agency Ranking
公开(公告)号：US20210375783A1
公开(公告)日：2021-12-02
申请号：US16931180
申请日：2020-07-16
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Chih-Hsien Chiu , Wen-Jung Tsai , Yu-Wei Yeh , Tsung-Hsien Tsai , Chi-Liang Shih , Sheng-Ming Yang , Ping-Hung Liao
IPC: H01L23/552 , H01L23/00 , H01L23/31 , H01L23/498
Abstract: An electronic package is provided and uses a plurality of bonding wires as a shielding structure. The bonding wires are stitch bonded onto a carrier carrying electronic components, such that the problem of the shielding structure peeling off or falling off from the carrier can be avoided due to the fact that the bonding wires are not affected by temperature, humidity and other environmental factors.
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公开(公告)号：US10566320B2
公开(公告)日：2020-02-18
申请号：US16211714
申请日：2018-12-06
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Chun-Chong Chien , Hsin-Lung Chung , Te-Fang Chu
IPC: H01L21/56 , H01L25/16 , H01L25/00 , H01L23/552 , H01L23/31 , H01L23/498 , H01L23/538
Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.
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公开(公告)号：US10181458B2
公开(公告)日：2019-01-15
申请号：US14981479
申请日：2015-12-28
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Chun-Chong Chien , Hsin-Lung Chun , Te-Fang Chu
IPC: H01L23/552 , H01L25/16 , H01L25/00 , H01L23/31 , H01L21/56 , H01L23/498 , H01L23/538
Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.
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公开(公告)号：US20160172762A1
公开(公告)日：2016-06-16
申请号：US14695469
申请日：2015-04-24
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chih-Hsien Chiu , Chi-Liang Shih
Abstract: An electronic module is provided, which includes: a substrate; an antenna body disposed over the substrate; and an encapsulant formed on the substrate and encapsulating the antenna body. A portion of the antenna body is exposed from the encapsulant. As such, the invention increases the arrangement area of the antenna body without increasing the size of the substrate, and also reduces the height of the encapsulant. Therefore, the electronic module of the present invention meets the miniaturization requirement.
Abstract translation: 提供了一种电子模块，其包括：基板; 设置在所述基板上的天线体; 以及形成在衬底上并封装天线体的密封剂。 天线体的一部分从密封剂暴露出来。 因此，本发明增加了天线体的布置面积，而不增加基板的尺寸，并且还降低了密封剂的高度。 因此，本发明的电子模块满足小型化要求。
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公开(公告)号：US20150243574A1
公开(公告)日：2015-08-27
申请号：US14256496
申请日：2014-04-18
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Sheng-Ming Yang , Hung-Cheng Chen , Chia-Yang Chen
IPC: H01L23/31 , H01L23/00 , H01L23/498 , H01L21/56
CPC classification number: H01L23/49838 , H01L23/3128 , H01L23/49816 , H01L23/50 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/32268 , H01L2224/451 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/83191 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19105 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.
Abstract translation: 提供了一种制造半导体封装的方法，其包括以下步骤：提供具有多个焊盘和相对的第二表面的具有第一表面的封装基板; 在所述包装基板的第一表面上设置多个无源元件; 通过粘合膜将半导体芯片设置在无源元件上; 通过多个接合线电连接半导体芯片和接合焊盘; 以及在所述封装衬底的所述第一表面上形成密封剂以封装所述半导体芯片，所述无源元件和所述接合线。 通过在封装基板和半导体芯片之间配置无源元件，本发明节约了封装基板上的空间，增加了布线灵活性。 此外，由于接合线不容易与无源元件接触，所以本发明防止发生短路。
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