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公开(公告)号：US20210305148A1
公开(公告)日：2021-09-30
申请号：US16868038
申请日：2020-05-06
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Cho-Hsin Chang , Hao-Ju Fang , Ting-Wei Chi , Te-Fang Chu
IPC: H01L23/498 , H01L21/48
Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.
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2.发明授权Semiconductor package with shielding member and method of manufacturing the same 有权具有屏蔽构件的半导体封装及其制造方法公开(公告)号：US09490219B2
公开(公告)日：2016-11-08
申请号：US14459678
申请日：2014-08-14
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Cho-Hsin Chang , Tsung-Hsien Hsu , Hsin-Lung Chung , Te-Fang Chu , Chia-Yang Chen
IPC: H01L23/552 , H01L21/56 , H01L23/66 , H01L23/31 , H01L23/00
CPC classification number: H01L23/552 , H01L21/56 , H01L23/3121 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2224/131 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/1421 , H01L2924/15313 , H01L2924/19105 , H01L2924/3025 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.
Abstract translation: 本发明提供一种半导体封装，包括衬底，设置在衬底上的多个半导体元件，设置在至少两个半导体元件之间的至少一个屏蔽构件和封装半导体元件和屏蔽构件的密封剂。 通过屏蔽部件，可以防止半导体元件之间引起的电磁干扰。
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公开(公告)号：US11527472B2
公开(公告)日：2022-12-13
申请号：US16868038
申请日：2020-05-06
Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
Inventor： Cho-Hsin Chang , Hao-Ju Fang , Ting-Wei Chi , Te-Fang Chu
IPC: H01L23/498 , H01L21/48
Abstract: A supporting structure is provided, which forms a protective layer on a metal member having a plurality of conductive posts, and the protective layer is exposed from end surfaces of the conductive posts, such that conductors are formed on the end surfaces of the conductive posts, thereby avoiding damage of the protective layer.
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公开(公告)号：US20140203771A1
公开(公告)日：2014-07-24
申请号：US13960033
申请日：2013-08-06
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Tsung-Hsien Hsu , Hsin-Lung Chung , Te-Fang Chu , Chia-Yang Chen , Kwok-Yan Lam
Abstract: An electronic package is provided, which includes: a substrate, a charging module and a coil module disposed on the substrate, and an encapsulant formed on the substrate for encapsulating the charging module and the coil module. The coil module has a plurality of coils having an opening, an adhesive compound formed on the coils in a manner that the opening of the coils is exposed from the adhesive compound, and a magnet inserted in the opening of the coils. Further, the adhesive compound comprises a metal oxide. Compared with the conventional ferrite, the adhesive compound is flexible and not easy to crack or break during transportation or assembly, thereby greatly improving the charging efficiency of the electronic package.
Abstract translation: 提供了一种电子封装，其包括：基板，充电模块和设置在基板上的线圈模块，以及形成在基板上的密封剂，用于封装充电模块和线圈模块。 线圈模块具有多个具有开口的线圈，形成在线圈上的粘合剂化合物以使得线圈的开口从粘合剂化合物暴露出来，以及插入在线圈的开口中的磁体。 此外，粘合剂化合物包含金属氧化物。 与常规铁氧体相比，粘合剂具有柔韧性，在运输或装配过程中不容易破裂或破裂，极大地提高了电子包装的充电效率。
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公开(公告)号：US20170040304A1
公开(公告)日：2017-02-09
申请号：US14981479
申请日：2015-12-28
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Chun-Chong Chien , Hsin-Lung Chun , Te-Fang Chu
CPC classification number: H01L25/16 , H01L21/56 , H01L23/3121 , H01L23/49816 , H01L23/5383 , H01L23/552 , H01L25/50 , H01L2224/16225 , H01L2224/32145 , H01L2224/48091 , H01L2224/48227 , H01L2224/97 , H01L2924/15192 , H01L2924/15311 , H01L2924/181 , H01L2924/19105 , H01L2924/19106 , H01L2924/3025 , H01L2924/00014 , H01L2924/00012 , H01L2224/81
Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.
Abstract translation: 提供电子封装，包括：具有相对的第一和第二表面的基板; 至少第一电子元件设置在所述基板的第一表面上; 封装所述第一电子元件的第一密封剂; 至少第二电子元件和设置在所述基板的第二表面上的框架; 以及封装所述第二电子元件的第二密封剂。 通过将第一和第二电子元件分别设置在基板的第一和第二表面上，本发明允许将所需数量的电子元件安装在基板上，而不需要增加基板的表面积。 由于电子封装的体积不增加，电子封装满足小型化要求。 本发明还提供一种制造电子封装的方法。
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Patent Agency Ranking
公开(公告)号：US09343401B2
公开(公告)日：2016-05-17
申请号：US14256496
申请日：2014-04-18
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Sheng-Ming Yang , Hung-Cheng Chen , Chia-Yang Chen
CPC classification number: H01L23/49838 , H01L23/3128 , H01L23/49816 , H01L23/50 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/46 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/83 , H01L24/92 , H01L2224/27436 , H01L2224/2919 , H01L2224/32225 , H01L2224/32268 , H01L2224/451 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2224/83191 , H01L2224/83385 , H01L2224/92247 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/19103 , H01L2924/19105 , H01L2224/45099 , H01L2924/00012 , H01L2924/00
Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a packaging substrate having a first surface with a plurality of bonding pads and an opposite second surface; disposing a plurality of passive elements on the first surface of the packaging substrate; disposing a semiconductor chip on the passive elements through an adhesive film; electrically connecting the semiconductor chip and the bonding pads through a plurality of bonding wires; and forming an encapsulant on the first surface of the packaging substrate for encapsulating the semiconductor chip, the passive elements and the bonding wires. By disposing the passive elements between the packaging substrate and the semiconductor chip, the invention saves space on the packaging substrate and increases the wiring flexibility. Further, since the bonding wires are not easy to come into contact with the passive elements, the invention prevents a short circuit from occurring.
Abstract translation: 提供了一种制造半导体封装的方法，其包括以下步骤：提供具有多个焊盘和相对的第二表面的具有第一表面的封装基板; 在所述包装基板的第一表面上设置多个无源元件; 通过粘合膜将半导体芯片设置在无源元件上; 通过多个接合线电连接半导体芯片和接合焊盘; 以及在所述封装衬底的所述第一表面上形成密封剂以封装所述半导体芯片，所述无源元件和所述接合线。 通过在封装基板和半导体芯片之间配置无源元件，本发明节约了封装基板上的空间，增加了布线灵活性。 此外，由于接合线不容易与无源元件接触，所以本发明防止发生短路。
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公开(公告)号：US20150366085A1
公开(公告)日：2015-12-17
申请号：US14564180
申请日：2014-12-09
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Hsin-Lung Chung , Te-Fang Chu , Hao-Ju Fang , Kuang-Neng Chung
CPC classification number: H05K1/111 , H01L21/565 , H01L23/3128 , H01L23/58 , H01L25/16 , H01L2224/16225 , H01L2224/48091 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00014
Abstract: A package structure is provided, which includes: a substrate having opposite first and second surfaces; at least an electronic element disposed on the first surface of the substrate; and an encapsulant formed on the first surface of the substrate for encapsulating the electronic element. The encapsulant has a non-rectangular shape so as to reduce an ineffective space in the encapsulant.
Abstract translation: 提供了一种封装结构，其包括：具有相对的第一和第二表面的基板; 至少设置在所述基板的第一表面上的电子元件; 以及形成在所述基板的所述第一表面上以封装所述电子元件的密封剂。 密封剂具有非矩形形状，以减少密封剂中的无效空间。
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公开(公告)号：US10566320B2
公开(公告)日：2020-02-18
申请号：US16211714
申请日：2018-12-06
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Chun-Chong Chien , Hsin-Lung Chung , Te-Fang Chu
IPC: H01L21/56 , H01L25/16 , H01L25/00 , H01L23/552 , H01L23/31 , H01L23/498 , H01L23/538
Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.
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公开(公告)号：US10181458B2
公开(公告)日：2019-01-15
申请号：US14981479
申请日：2015-12-28
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Chi-Liang Shih , Chun-Chong Chien , Hsin-Lung Chun , Te-Fang Chu
IPC: H01L23/552 , H01L25/16 , H01L25/00 , H01L23/31 , H01L21/56 , H01L23/498 , H01L23/538
Abstract: An electronic package is provided, including: a substrate having opposite first and second surfaces; at least a first electronic element disposed on the first surface of the substrate; a first encapsulant encapsulating the first electronic element; at least a second electronic element and a frame disposed on the second surface of the substrate; and a second encapsulant encapsulating the second electronic element. By disposing the first and second electronic elements on the first and second surfaces of the substrate, respectively, the invention allows a required number of electronic elements to be mounted on the substrate without the need to increase the surface area of the substrate. Since the volume of the electronic package does not increase, the electronic package meets the miniaturization requirement. The present invention further provides a method for fabricating the electronic package.
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公开(公告)号：US20150333017A1
公开(公告)日：2015-11-19
申请号：US14459678
申请日：2014-08-14
Applicant: Siliconware Precision Industries Co., Ltd.
Inventor： Cho-Hsin Chang , Tsung-Hsien Hsu , Hsin-Lung Chung , Te-Fang Chu , Chia-Yang Chen
IPC: H01L23/552 , H01L23/66 , H01L21/56
CPC classification number: H01L23/552 , H01L21/56 , H01L23/3121 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/48 , H01L24/49 , H01L2224/131 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2224/49175 , H01L2924/00014 , H01L2924/1421 , H01L2924/15313 , H01L2924/19105 , H01L2924/3025 , H01L2924/014 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
Abstract: This invention provides a semiconductor package, including a substrate, a plurality of semiconductor elements disposed on the substrate, at least one shielding member disposed between at least two of the semiconductor elements, and an encapsulant encapsulating the semiconductor elements and shielding members. Through the shielding member, electromagnetic interference caused among semiconductor elements can be prevented.
Abstract translation: 本发明提供一种半导体封装，包括衬底，设置在衬底上的多个半导体元件，设置在至少两个半导体元件之间的至少一个屏蔽构件和封装半导体元件和屏蔽构件的密封剂。 通过屏蔽部件，可以防止半导体元件之间引起的电磁干扰。
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