Invention Grant
- Patent Title: Layout pattern decomposition method
- Patent Title (中): 布局图案分解方法
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Application No.: US14504401Application Date: 2014-10-01
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Publication No.: US09529254B2Publication Date: 2016-12-27
- Inventor: Chih-Hsien Tang , Yao-Jen Fan , Chin-Lung Lin
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Priority: TW103128354A 20140818
- Main IPC: G03B27/32
- IPC: G03B27/32 ; G03F1/00 ; G06F17/50 ; G03F1/70 ; G03F7/20

Abstract:
A layout pattern decomposition method includes following steps. A layout pattern is received. The layout pattern includes a plurality of features, and an edge-to-edge space is respectively defined in between two adjacent features. A sum of a width of the edge-to-edge space and a width of the feature on a left side of the edge-to-edge space and a sum of the width of the edge-to-edge space and a width of the feature on a right side of the edge-to-edge space are respectively calculated. The sums and a predetermined value are respectively compared. When any one of the sums is smaller than the predetermined value, the two features on the two sides of the edge-to-edge space are colored by a first color and alternatively a second color. The features including the first color are assigned to a first pattern and the features including the second color to a second pattern.
Public/Granted literature
- US20160048072A1 LAYOUT PATTERN DECOMPOSITION METHOD Public/Granted day:2016-02-18
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