发明授权
- 专利标题： Package structure and the method to fabricate thereof
- 专利标题（中）： 包装结构及其制造方法
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申请号： US13401853申请日： 2012-02-22
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公开(公告)号： US09536798B2公开(公告)日： 2017-01-03
- 发明人: Bau-Ru Lu , Jeng-Jen Li , Kun-Hong Shih , Kaipeng Chiang
- 申请人： Bau-Ru Lu , Jeng-Jen Li , Kun-Hong Shih , Kaipeng Chiang
- 申请人地址： TW Hsinchu
- 专利权人： CYNTEC CO., LTD.
- 当前专利权人： CYNTEC CO., LTD.
- 当前专利权人地址： TW Hsinchu
- 代理机构： Litron Patent & Trademark Office
- 代理商 Min-Lee Teng
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; H01L23/13 ; H05K1/02 ; H05K1/18 ; H01L23/498 ; H01L21/56 ; H01L23/00
摘要：
The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.
公开/授权文献
- US20130213704A1 PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF 公开/授权日：2013-08-22
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