Invention Grant
- Patent Title: Encapsulated electronic chip device with mounting provision and externally accessible electric connection structure
- Patent Title (中): 封装的电子芯片器件，具有安装和外部可访问的电连接结构
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Application No.: US14815367Application Date: 2015-07-31
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Publication No.: US09536816B2Publication Date: 2017-01-03
- Inventor: Angela Kessler , Eduard Knauer , Rudolf Lehner , Wolfgang Schober , Sigrid Schultes
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102014110967 20140801
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/31 ; H01L23/492 ; H01L23/498 ; H01L21/56 ; H01L23/36 ; H01L23/373 ; H01L23/40
Abstract:
An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric connection structure mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and partially encapsulating the at least one electric connection structure so that part of a surface of the at least one electric connection structure is exposed to an environment, and a mounting provision configured for mounting the electronic device at a periphery device.
Public/Granted literature
Information query
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