公开(公告)号：US09536816B2

公开(公告)日：2017-01-03

申请号：US14815367

申请日：2015-07-31

Applicant: Infineon Technologies AG

Inventor： Angela Kessler ,  Eduard Knauer ,  Rudolf Lehner ,  Wolfgang Schober ,  Sigrid Schultes

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/492 ,  H01L23/498 ,  H01L21/56 ,  H01L23/36 ,  H01L23/373 ,  H01L23/40

CPC classification number: H01L23/49811 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/3735 ,  H01L23/4006 ,  H01L23/492 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/5389 ,  H01L2224/32225 ,  H01L2924/181 ,  H01L2924/00012

Abstract: An electronic device comprising a carrier having a mounting surface, at least one electronic chip mounted on the mounting surface, at least one electric connection structure mounted on the mounting surface, an encapsulant at least partially encapsulating the carrier and the at least one electronic chip, and partially encapsulating the at least one electric connection structure so that part of a surface of the at least one electric connection structure is exposed to an environment, and a mounting provision configured for mounting the electronic device at a periphery device.

Abstract translation: 一种电子设备，包括具有安装表面的载体，安装在所述安装表面上的至少一个电子芯片，安装在所述安装表面上的至少一个电连接结构，至少部分地封装所述载体和所述至少一个电子芯片的密封剂， 并且部分地封装所述至少一个电连接结构，使得所述至少一个电连接结构的表面的一部分暴露于环境;以及安装配置，用于将所述电子设备安装在周边设备。