Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
-
Application No.: US14198430Application Date: 2014-03-05
-
Publication No.: US09536978B2Publication Date: 2017-01-03
- Inventor: Tatsuo Nakayama , Hironobu Miyamoto , Yasuhiro Okamoto , Ryohei Nega , Masaaki Kanazawa , Takashi Inoue
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Kawasaki-shi, Kanagawa
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi, Kanagawa
- Agency: McGinn IP Law Group, PLLC
- Priority: JP2013-051047 20130313
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/66 ; H01L29/15 ; H01L29/20

Abstract:
To improve performance of a semiconductor device. For example, on the assumption that a superlattice layer is inserted between a buffer layer and a channel layer, a concentration of acceptors introduced into nitride semiconductor layers forming a part of the superlattice layer is higher than a concentration of acceptors introduced into nitride semiconductor layers forming the other part of the superlattice layer. That is, the concentration of acceptors introduced into the nitride semiconductor layers having a small band gap is higher than the concentration of acceptors introduced into the nitride semiconductor layers having a large band gap.
Public/Granted literature
- US20140264274A1 SEMICONDUCTOR DEVICE Public/Granted day:2014-09-18
Information query
IPC分类: