Invention Grant
US09540228B2 MEMS-CMOS device that minimizes outgassing and methods of manufacture 有权
最小化除气的MEMS-CMOS器件和制造方法

MEMS-CMOS device that minimizes outgassing and methods of manufacture
Abstract:
A MEMS device is disclosed. The MEMS device includes a first substrate. At least one structure is formed within the first substrate. The first substrate includes at least one first conductive pad thereon. The MEMS device also includes a second substrate. The second substrate includes a passivation layer. The passivation layer includes a plurality of layers. A top layer of the plurality of layers comprises an outgassing barrier layer. At least one second conductive pad and at least one electrode are coupled to the top layer. At least one first conductive pad is coupled to the at least one second conductive pad.
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