Invention Grant
- Patent Title: Positive resist composition and method of pattern formation with the same
- Patent Title (中): 积极的抗蚀剂组成和图案形成方法相同
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Application No.: US14638471Application Date: 2015-03-04
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Publication No.: US09541831B2Publication Date: 2017-01-10
- Inventor: Hiromi Kanda , Shinichi Kanna , Haruki Inabe
- Applicant: FUJIFILM Corporation
- Applicant Address: JP Tokyo
- Assignee: FUJIFILM Corporation
- Current Assignee: FUJIFILM Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2005-215412 20050726; JP2005-356714 20051209; JP2006-7762 20060116; JP2006-107727 20060410; JP2006-198897 20060721
- Main IPC: G03F7/039
- IPC: G03F7/039 ; G03F7/20 ; G03F7/30 ; G03F7/004
Abstract:
A positive resist composition comprising: (A) a resin which comes to have an enhanced solubility in an alkaline developing solution by an action of an acid; (B) a compound which generates an acid upon irradiation with actinic rays or a radiation; (C) a fluorine-containing compound containing at least one group selected from the groups (x) to (z); and (F) a solvent, and a method of pattern formation with the composition: (x) an alkali-soluble group; (y) a group which decomposes by an action of an alkaline developing solution to enhance a solubility in an alkaline developing solution; and (z) a group which decomposes by an action of an acid.
Public/Granted literature
- US20150185609A1 POSITIVE RESIST COMPOSITION AND METHOD OF PATTERN FORMATION WITH THE SAME Public/Granted day:2015-07-02
Information query
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