A semiconductor device includes a substrate, an elastic buffer layer disposed on a surface of the substrate, wiring patterns disposed on a first surface of the elastic buffer layer, and a semiconductor chip disposed on a second surface of the elastic buffer layer facing away from the first surface of the elastic buffer layer. The semiconductor chip includes trenches formed on a surface facing the elastic buffer layer. Interconnection members are disposed to electrically connect the elastic buffer layer to the substrate. Each of the interconnection members has one end electrically connected to one of the wiring patterns and the other end electrically connected to the substrate.