Invention Grant
- Patent Title: High density organic bridge device and method
- Patent Title (中): 高密度有机桥装置及方法
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Application No.: US14992535Application Date: 2016-01-11
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Publication No.: US09548264B2Publication Date: 2017-01-17
- Inventor: Mihir K. Roy , Stefanie M. Lotz , Wei-Lun Kane Jen
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L25/065 ; H01L23/14 ; H01L23/538 ; H01L21/48 ; H05K1/03 ; H05K1/14 ; H05K3/46 ; H01L23/00 ; H05K1/18

Abstract:
Embodiments that allow multi-chip interconnect using organic bridges are described. In some embodiments an organic package substrate has an embedded organic bridge. The organic bridge can have interconnect structures that allow attachment of die to be interconnected by the organic bridge. In some embodiments, the organic bridge comprises a metal routing layer, a metal pad layer and interleaved organic polymer dielectric layers but without a substrate layer. Embodiments having only a few layers may be embedded into the top layer or top few layers of the organic package substrate. Methods of manufacture are also described.
Public/Granted literature
- US09496209B2 High density organic bridge device and method Public/Granted day:2016-11-15
Information query
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