Invention Grant
- Patent Title: Multilayer capacitor with integrated busbar
- Patent Title (中): 带集成母线的多层电容器
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Application No.: US14168204Application Date: 2014-01-30
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Publication No.: US09552926B2Publication Date: 2017-01-24
- Inventor: John Horowy , Gary L. Galloway , Debabrata Pal , Eric Karlen , Mark W. Metzler
- Applicant: HAMILTON SUNDSTRAND CORPORATION
- Applicant Address: US CT Windsor Locks
- Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee: HAMILTON SUNDSTRAND CORPORATION
- Current Assignee Address: US CT Windsor Locks
- Agency: Cantor Colburn LLP
- Main IPC: H01G4/14
- IPC: H01G4/14 ; H01G4/228 ; G06F17/50

Abstract:
Embodiments are directed to obtaining a specification of at least one operational requirement for at least one capacitor, generating a design of the at least one capacitor to satisfy the at least one operational requirement, the design of the at least one capacitor comprising a plurality of layers and a first integrated busbar coupled to at least a portion of the layers, and based on the design, manufacturing the at least one capacitor by utilizing an additive manufacturing technique.
Public/Granted literature
- US20150213952A1 MULTILAYER CAPACITOR WITH INTEGRATED BUSBAR Public/Granted day:2015-07-30
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