Invention Grant
- Patent Title: Package structure for photonic transceiving device
- Patent Title (中): 光子收发器的封装结构
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Application No.: US14793636Application Date: 2015-07-07
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Publication No.: US09553671B1Publication Date: 2017-01-24
- Inventor: Radhakrishnan L. Nagarajan , Peng-Chih Li , Masaki Kato
- Applicant: Inphi Corporation
- Applicant Address: US CA Santa Clara
- Assignee: INPHI CORPORATION
- Current Assignee: INPHI CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Ogawa P.C.
- Agent Richard T. Ogawa
- Main IPC: H04B10/00
- IPC: H04B10/00 ; H04B10/40 ; H04B10/516

Abstract:
A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
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