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    Small form factor transmitting device
    1.
    发明授权
    Small form factor transmitting device 有权

    公开(公告)号：US10892598B2

    公开(公告)日：2021-01-12

    申请号：US16679014

    申请日：2019-11-08

    Applicant: INPHI CORPORATION ,  Luxnet Corporation

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Pi-Cheng Law

    IPC: H01S5/06 ,  H04B10/50 ,  H01S5/024 ,  H01S5/00 ,  H01S5/022 ,  G02B6/42 ,  H01S5/068 ,  H01S5/125

    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    Small form factor transmitting device
    2.
    发明授权
    Small form factor transmitting device 有权

    公开(公告)号：US10559941B2

    公开(公告)日：2020-02-11

    申请号：US16160817

    申请日：2018-10-15

    Applicant: INPHI CORPORATION ,  LUXNET CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Pi-Cheng Law

    IPC: H01S5/06 ,  G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  H01S5/125 ,  H04B10/50 ,  H01S5/024 ,  H01S5/068

    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    Package structure for photonic transceiving device
    4.
    发明授权
    Package structure for photonic transceiving device 有权

    公开(公告)号：US10908370B2

    公开(公告)日：2021-02-02

    申请号：US16793550

    申请日：2020-02-18

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: G02B6/42 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    Package structure for photonic transceiving device
    5.
    发明授权
    Package structure for photonic transceiving device 有权

    公开(公告)号：US10605999B2

    公开(公告)日：2020-03-31

    申请号：US16579671

    申请日：2019-09-23

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: G02B6/42 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    Package structure for photonic transceiving device
    6.
    发明授权
    Package structure for photonic transceiving device 有权

    公开(公告)号：US10466431B2

    公开(公告)日：2019-11-05

    申请号：US16352054

    申请日：2019-03-13

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: G02B6/42 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    Small form factor transmitting device
    7.
    发明授权
    Small form factor transmitting device 有权

    公开(公告)号：US10141717B2

    公开(公告)日：2018-11-27

    申请号：US15855927

    申请日：2017-12-27

    Applicant: INPHI CORPORATION ,  Luxnet Corporation

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Pi-Cheng Law

    IPC: H04B10/50 ,  G02B6/42 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024 ,  H01S5/068 ,  H01S5/06 ,  H01S5/125

    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

    Package structure for photonic transceiving device
    9.
    发明授权
    Package structure for photonic transceiving device 有权
    光子收发器的封装结构

    公开(公告)号：US09553671B1

    公开(公告)日：2017-01-24

    申请号：US14793636

    申请日：2015-07-07

    Applicant: Inphi Corporation

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: H04B10/00 ,  H04B10/40 ,  H04B10/516

    CPC classification number: G02B6/4246 ,  G02B6/421 ,  G02B6/4215 ,  G02B6/4249 ,  G02B6/4256 ,  G02B6/4278 ,  G02B6/428 ,  G02B6/4292 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in Quad Small Form-factor Pluggable (QSFP) package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a printed circuit board (PCB), installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

    Abstract translation: 四芯小型可插拔（QSFP）封装中的光子收发器设备。 该装置包括具有底座构件，两个部分侧构件和盖构件的壳体，以在基座构件的后端提供具有开口的空间体积。 此外，该设备包括印刷电路板（PCB），该印刷电路板（PCB）安装在基座部件的空间体积内部，在后端具有可插拔的电连接器。 此外，该装置包括微型发射 - 光学 - 子组件封装中的多个光学传输装置，每个光学传输装置均安装在共同的支撑结构上，并且具有朝向后端的反向取向的激光输出端口。 此外，该装置包括硅光子芯片，其包括安装在PCB上的光纤到硅附着模块，并耦合到调制驱动器模块和跨阻放大器模块。 此外，该装置包括一对光输入/输出端口，其后连接到光纤到硅附接模块。

    Package structure for photonic transceiving device
    10.
    发明授权
    Package structure for photonic transceiving device 有权

    公开(公告)号：US10274688B2

    公开(公告)日：2019-04-30

    申请号：US16013737

    申请日：2018-06-20

    Applicant: INPHI CORPORATION

    Inventor： Radhakrishnan L. Nagarajan ,  Peng-Chih Li ,  Masaki Kato

    IPC: G02B6/42 ,  H04B10/40 ,  H04B10/516

    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.

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