Invention Grant
US09557652B2 Use of compositions comprising a surfactant and a hydrophobizer for avoiding anti pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below
有权
使用包含表面活性剂和疏水化剂的组合物，用于在线空间尺寸为50nm或以下时处理图案化材料时避免抗图案塌陷
- Patent Title: Use of compositions comprising a surfactant and a hydrophobizer for avoiding anti pattern collapse when treating patterned materials with line-space dimensions of 50 nm or below
- Patent Title (中): 使用包含表面活性剂和疏水化剂的组合物，用于在线空间尺寸为50nm或以下时处理图案化材料时避免抗图案塌陷
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Application No.: US14652120Application Date: 2013-12-04
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Publication No.: US09557652B2Publication Date: 2017-01-31
- Inventor: Andreas Klipp , Andrei Honciuc , Günter Oetter , Christian Bittner
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: Armstrong Teasdale LLP
- International Application: PCT/IB2013/060616 WO 20131204
- International Announcement: WO2014/091363 WO 20140619
- Main IPC: G03F7/42
- IPC: G03F7/42 ; H01L21/02 ; H01L21/027 ; C11D1/835 ; C11D1/94 ; C11D11/00 ; G03F7/20 ; G03F7/40
Abstract:
In a method of treating a substrate including patterns having line-space dimensions of 50 nm or below, the substrate is rinsed by an aqueous composition including at least one non-ionic surfactant A and at least one hydrophobizer B. The at least one surfactant A has an equilibrium surface tension of 10 mN/m to 35 mN/m, determined from a solution of the at least one surfactant A in water at the critical micelle concentration. The hydrophobizer B is selected so that the contact angle of water to the substrate is increased by contacting the substrate with a solution of the hydrophobizer B in water by 5-95° compared to the contact angle of water to the substrate before such contacting.
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