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US09558994B2 Semiconductor devices and methods of fabricating the same 有权
半导体器件及其制造方法

Semiconductor devices and methods of fabricating the same
Abstract:
A semiconductor device includes a substrate including a first region and a second region, first conductive patterns disposed on the first region and spaced apart from each other by a first distance, second conductive patterns disposed on the second region and spaced apart from each other by a second distance greater than the first distance, and an interlayer insulating layer disposed between the second conductive patterns and including at least one recess region having a width corresponding to the first distance.
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