Invention Grant
- Patent Title: Light emitting device package and light emitting apparatus including the package
- Patent Title (中): 包括该封装的发光器件封装和发光装置
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Application No.: US14922620Application Date: 2015-10-26
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Publication No.: US09559264B2Publication Date: 2017-01-31
- Inventor: Woo Sik Lim , Jae Won Seo , Bum Jin Yim
- Applicant: LG INNOTEK CO., LTD.
- Applicant Address: KR Seoul
- Assignee: LG INNOTEK CO., LTD.
- Current Assignee: LG INNOTEK CO., LTD.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates, LLP
- Priority: KR10-2014-0145830 20141027
- Main IPC: H01L33/40
- IPC: H01L33/40 ; H01L33/42 ; H01L33/38 ; H01L33/44 ; H01L33/46 ; H01L33/62

Abstract:
A light emitting device may include a substrate, a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a first electrode configured to penetrate the second conductive semiconductor layer and the active layer, so as to come into contact with the first conductive semiconductor layer, a contact layer configured to come into contact with the second conductive semiconductor layer, a first insulation layer disposed between the second conductive semiconductor layer and the first electrode and between the active layer and the first electrode, the first insulation layer being provided for capping of a side portion and an upper portion of the contact layer, and a second electrode configured to penetrate the first insulation layer, so as to come into contact with the contact layer.
Public/Granted literature
- US20160118543A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING APPARATUS INCLUDING THE PACKAGE Public/Granted day:2016-04-28
Information query
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