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    Light-emitting element and light-emitting element package including the same
    1.
    发明授权
    Light-emitting element and light-emitting element package including the same 有权

    公开(公告)号：US10892390B2

    公开(公告)日：2021-01-12

    申请号：US16075490

    申请日：2017-02-03

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jae Won Seo ,  Sang Youl Lee ,  Woo Sik Lim

    IPC: H01L33/62 ,  H01L33/42 ,  H01L33/38 ,  H01L33/40 ,  H01L33/10 ,  H01L33/46 ,  H01L33/32 ,  H01L33/22

    Abstract: A light-emitting element according to an embodiment comprises: a light-emitting structure including a first conductive type semiconductor layer, a second conductive type semiconductor layer, and an active layer formed between the first and second conductive type semiconductor layers; a reflective layer formed on the second conductive type semiconductor layer; a capping layer formed on the reflective layer to surround the reflective layer; a first electrode electrically connected with the first conductive type semiconductor layer; a first bonding pad electrically connected with the first electrode; and a second bonding pad electrically connected with the second electrode, wherein the light-emitting structure includes a recess extending to a region of the first conductive type semiconductor layer through the second conductive type semiconductor layer and the active layer; the first electrode is formed within the recess and electrically connected with the first conductive type semiconductor layer, and includes a region bent along a side surface of the second bonding pad; the reflective layer is formed to be spaced apart from the recess; and the capping layer includes a transparent electrode.

    Light emitting device package and lighting apparatus
    2.
    发明授权
    Light emitting device package and lighting apparatus 有权

    公开(公告)号：US10381519B2

    公开(公告)日：2019-08-13

    申请号：US15550955

    申请日：2016-03-16

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jae Won Seo ,  Hoe Jun Kim ,  Bum Jin Yim ,  Jun Hee Hong

    IPC: H01L33/44 ,  H01L33/62 ,  H01L33/38 ,  H01L33/32 ,  H01L33/40 ,  H01L33/14

    Abstract: A light emitting device package, according to an embodiment, includes: a substrate; a light emitting structure that is disposed below the substrate and includes a first conductive type semiconductor layer, an active layer, and a second conductive type semiconductor layer; a first bonding pad connected with the first conductive type semiconductor layer while being embedded in a through-hole exposed the first conductive type semiconductor layer by passing through the active layer and the second conductive type semiconductor layer; a second bonding pad that is disposed below the second conductive type semiconductor layer while being spaced apart from the first bonding pad and is connected with the second conductive type semiconductor layer; a first insulation layer disposed on the lateral portion of the light emitting structure in the through-hole and on the lower inner edge of the light emitting structure; and a second insulation layer disposed between the first insulation layer and the first bonding pad in the through-hole.

    Light emitting element and lighting device
    3.
    发明授权
    Light emitting element and lighting device 有权

    公开(公告)号：US10333031B2

    公开(公告)日：2019-06-25

    申请号：US16215238

    申请日：2018-12-10

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Woo Sik Lim ,  Jae Won Seo

    IPC: H01L33/46 ,  H01L33/38 ,  H01L33/44 ,  H01L33/48 ,  H01L33/62 ,  H01L33/40

    Abstract: A light emitting element according to an embodiment includes a substrate; a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer which are disposed on the substrate; a reflective layer which is disposed on the light emitting structure and has first and second areas neighboring each other in a horizontal direction; a first electrode which is disposed in at least a portion of the first area of the reflective layer with passing through the second conductive semiconductor layer and the active layer and extending to the first conductive semiconductor layer; a first insulating layer disposed between the first electrode and the side of the light emitting structure and between the first electrode and the reflective layer; a diffusion barrier layer disposed in the second area of the reflective layer; a second insulating layer disposed on the first electrode and the diffusion barrier layer; and first and second bonding layers which pass through the second insulating layer and are connected to the first electrode and the diffusion barrier layer, respectively.

    Light emitting device and lighting apparatus
    6.
    发明授权
    Light emitting device and lighting apparatus 有权

    公开(公告)号：US10411166B2

    公开(公告)日：2019-09-10

    申请号：US16363178

    申请日：2019-03-25

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Woo Sik Lim ,  Jae Won Seo

    IPC: H01L33/46 ,  H01L33/44 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62 ,  H01L33/40

    Abstract: A light emitting device includes a substrate; a light emitting structure disposed on the substrate and including a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer disposed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer; a first electrode electrically connected to the first conductivity type semiconductor layer; a second electrode electrically connected to the second conductivity type semiconductor layer; a first insulation layer disposed on the light emitting structure; a second insulation layer disposed on the first insulation layer; and a first pad and a second pad arranged over the second insulation layer.

    Light emitting device and lighting apparatus
    8.
    发明授权
    Light emitting device and lighting apparatus 有权

    公开(公告)号：US10186639B2

    公开(公告)日：2019-01-22

    申请号：US15315938

    申请日：2015-05-26

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Woo Sik Lim ,  Jae Won Seo

    IPC: H01L33/46 ,  H01L33/44 ,  H01L33/38 ,  H01L33/48 ,  H01L33/62 ,  H01L33/40

    Abstract: A light emitting element according to an embodiment includes a substrate; a light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer which are disposed on the substrate; a reflective layer which is disposed on the light emitting structure and has first and second areas neighboring each other in a horizontal direction; a first electrode which is disposed in at least a portion of the first area of the reflective layer with passing through the second conductive semiconductor layer and the active layer and extending to the first conductive semiconductor layer; a first insulating layer disposed between the first electrode and the side of the light emitting structure and between the first electrode and the reflective layer; a diffusion barrier layer disposed in the second area of the reflective layer; a second insulating layer disposed on the first electrode and the diffusion barrier layer; and first and second bonding layers which pass through the second insulating layer and are connected to the first electrode and the diffusion barrier layer, respectively.

    Light emitting device package and light emitting apparatus including the package
    9.
    发明授权
    Light emitting device package and light emitting apparatus including the package 有权
    包括该封装的发光器件封装和发光装置

    公开(公告)号：US09559264B2

    公开(公告)日：2017-01-31

    申请号：US14922620

    申请日：2015-10-26

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Woo Sik Lim ,  Jae Won Seo ,  Bum Jin Yim

    IPC: H01L33/40 ,  H01L33/42 ,  H01L33/38 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62

    CPC classification number: H01L33/405 ,  H01L33/382 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/16245 ,  H01L2924/181 ,  H01L2924/00012

    Abstract: A light emitting device may include a substrate, a light emitting structure disposed under the substrate, the light emitting structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer, a first electrode configured to penetrate the second conductive semiconductor layer and the active layer, so as to come into contact with the first conductive semiconductor layer, a contact layer configured to come into contact with the second conductive semiconductor layer, a first insulation layer disposed between the second conductive semiconductor layer and the first electrode and between the active layer and the first electrode, the first insulation layer being provided for capping of a side portion and an upper portion of the contact layer, and a second electrode configured to penetrate the first insulation layer, so as to come into contact with the contact layer.

    Abstract translation: 发光器件可以包括衬底，设置在衬底下方的发光结构，发光结构包括第一导电半导体层，有源层和第二导电半导体层，第一电极被配置为穿透第二导电半导体 层和有源层，以便与第一导电半导体层接触，被配置为与第二导电半导体层接触的接触层，设置在第二导电半导体层和第一电极之间的第一绝缘层和 在所述有源层和所述第一电极之间，所述第一绝缘层设置成用于封盖所述接触层的侧部和上部;以及第二电极，被配置为穿透所述第一绝缘层，以便与所述接触层接触 接触层。

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