发明授权
- 专利标题： Semiconductor package having routing traces therein
- 专利标题（中）： 其中具有路由迹线的半导体封装
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申请号： US14794715申请日： 2015-07-08
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公开(公告)号： US09564387B2公开(公告)日： 2017-02-07
- 发明人: Saravuth Sirinorakul , Antonio Bambalan Dimaano, Jr. , Rui Huang
- 申请人： UTAC Headquarters Pte. Ltd.
- 申请人地址： SG Singapore
- 专利权人： UTAC HEADQUARTERS PTE. LTD.
- 当前专利权人： UTAC HEADQUARTERS PTE. LTD.
- 当前专利权人地址： SG Singapore
- 代理机构： Haverstock & Owens LLP
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/48 ; H01L23/31 ; H01L21/66 ; H01L21/56 ; H01L23/00
摘要：
A method of and device for making a semiconductor package. The method comprises etching a first side of a metallic piece forming a leadframe with one or more wire bonding pads, applying a first protective layer on the first side, etching a second side of the metallic piece forming one or more conductive terminals, and applying a second protective layer on the second side. The semiconductor package comprises wire bonding pads in pillars structure surrounding a die attached to the leadframe. One or more terminals are on the bottom side of the semiconductor package.
公开/授权文献
- US20160064310A1 SEMICONDUCTOR PACKAGE HAVING ROUTING TRACES THEREIN 公开/授权日：2016-03-03
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