Invention Grant
- Patent Title: Lightweight cavity filter structure
- Patent Title (中): 轻型腔体过滤结构
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Application No.: US13426257Application Date: 2012-03-21
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Publication No.: US09564672B2Publication Date: 2017-02-07
- Inventor: Ian Burke , Jason Cook , Ahmad Khanifar
- Applicant: Ian Burke , Jason Cook , Ahmad Khanifar
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: H01P11/00
- IPC: H01P11/00 ; H01P1/208 ; C23C18/16 ; C23C28/02 ; C25D1/02 ; C25D7/00

Abstract:
Embodiments provide a novel fabrication method and structure for reducing structural weight in radio frequency cavity filters and novel filter structure. The novel filter structure is fabricated by electroplating the required structure over a mold. The electrodeposited composite layer may be formed by several layers of metal or metal alloys with compensating thermal expansion coefficients. The first or the top layer is a high conductivity material or compound such as silver having a thickness of several times the skin-depth at the intended frequency of operation. The top layer provides the vital low loss performance and high Q-factor required for such filter structures while the subsequent compound layers provide the mechanical strength.
Public/Granted literature
- US20120242425A1 LIGHTWEIGHT CAVITY FILTER STRUCTURE Public/Granted day:2012-09-27
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