Invention Grant
- Patent Title: Heat dissipation device loading mechanisms
- Patent Title (中): 散热装置加载机构
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Application No.: US13993335Application Date: 2011-12-13
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Publication No.: US09565787B2Publication Date: 2017-02-07
- Inventor: Chau V. Ho , Tejinder Pal S. Aulakh
- Applicant: Chau V. Ho , Tejinder Pal S. Aulakh
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Winkle, PLLC
- International Application: PCT/US2011/064591 WO 20111213
- International Announcement: WO2013/089677 WO 20130620
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H05K7/20 ; H01L23/36 ; H01L23/40
Abstract:
The present description relates to the field of microelectronic assemblies, wherein a heat dissipation device may be incorporated into the microelectronic assembly with a loading mechanism having at least one outrigger that is rotatable or pivotable between a first position and a second position to accommodate different heat dissipation device sizes or shapes.
Public/Granted literature
- US20140218870A1 HEAT DISSIPATION DEVICE LOADING MECHANISMS Public/Granted day:2014-08-07
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