Invention Grant
- Patent Title: Polishing of hard substrates with soft-core composite particles
- Patent Title (中): 用软核复合颗粒抛光硬质基材
-
Application No.: US14471755Application Date: 2014-08-28
-
Publication No.: US09567492B2Publication Date: 2017-02-14
- Inventor: Rajiv K. Singh , Arul Chakkaravarthi Arjunan , Kannan Balasundaram , Deepika Singh , Wei Bai
- Applicant: SINMAT, INC. , UNIVERSITY OF FLORIDA RESEARCH FOUNDATION, INC.
- Applicant Address: US FL Gainesville US FL Gainesville
- Assignee: Sinmat, Inc.,University of Florida Research Foundation, Inc.
- Current Assignee: Sinmat, Inc.,University of Florida Research Foundation, Inc.
- Current Assignee Address: US FL Gainesville US FL Gainesville
- Agency: Jetter & Associates, P.A.
- Main IPC: C09G1/04
- IPC: C09G1/04 ; C09K3/14 ; C09G1/02 ; C30B33/00 ; H01L21/306 ; H01L21/02 ; B24B37/04
Abstract:
A chemical mechanical polishing (CMP) includes providing a slurry including composite particles dispersed in a water-based carrier that comprise a plurality of hard particles on an outer surface of a soft-core particle. The hard particles have a Mohs hardness at least 1 greater than a Mohs hardness of the soft core particle and/or a Vickers hardness at least 500 Kg/mm2 greater than the soft-core particle. A substrate having a substrate surface with a hardness greater than a Mohs number of 6 or a Vickers hardness greater than 1,000 kg/mm2 is placed into a CMP apparatus having a rotating polishing pad, and CMP is performed with the rotating polishing pad and the slurry to polish the substrate surface.
Public/Granted literature
- US20160060488A1 POLISHING OF HARD SUBSTRATES WITH SOFT-CORE COMPOSITE PARTICLES Public/Granted day:2016-03-03
Information query
