发明授权
- 专利标题： Use of an external getter to reduce package pressure
- 专利标题（中）： 使用外部吸气剂降低包装压力
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申请号： US14887544申请日： 2015-10-20
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公开(公告)号： US09570321B1公开(公告)日： 2017-02-14
- 发明人: Stephen H. Black , Adam M. Kennedy
- 申请人： RAYTHEON COMPANY
- 申请人地址： US MA Waltham
- 专利权人： RAYTHEON COMPANY
- 当前专利权人： RAYTHEON COMPANY
- 当前专利权人地址： US MA Waltham
- 代理机构： Lando & Anastasi, LLP
- 主分类号： H01L21/322
- IPC分类号： H01L21/322 ; H01L23/26 ; H01L23/544
摘要：
A system and method for forming a wafer level package. In one example, a substrate used in the wafer level package includes a surface defined by a wafer level package (WLP) region and an external region, and a layer of getter material is disposed on at least a portion of the external region. According to one embodiment, the external region comprises a saw-to-reveal (STR) region of the wafer.