Invention Grant
- Patent Title: Device comprising a ductile layer and method of making the same
- Patent Title (中): 包含延展层的装置及其制造方法
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Application No.: US15093528Application Date: 2016-04-07
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Publication No.: US09576867B2Publication Date: 2017-02-21
- Inventor: Georg Meyer-Berg , Reinhard Pufall
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L21/66 ; G01R31/26 ; G01R31/28 ; H01L23/58 ; H01L21/768 ; H01L23/532 ; H01L23/00 ; H01L23/522 ; H01L23/525
Abstract:
Device comprising a ductile layer, a method for making a component comprising a ductile layer and a method for testing a component are disclosed. An embodiment includes an electronic device including a first conductive layer, a ductile layer and a brittle layer between the first conductive layer and the ductile layer.
Public/Granted literature
- US20160218044A1 Device Comprising a Ductile Layer and Method of Making the Same Public/Granted day:2016-07-28
Information query
IPC分类:
