Invention Grant
- Patent Title: Medical device with surface mounted lead connector
- Patent Title (中): 具有表面安装导线连接器的医疗设备
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Application No.: US14570531Application Date: 2014-12-15
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Publication No.: US09579511B2Publication Date: 2017-02-28
- Inventor: Mark E. Henschel , Songhua Shi
- Applicant: Medtronic, Inc.
- Applicant Address: US MN Minneapolis
- Assignee: Medtronic, Inc.
- Current Assignee: Medtronic, Inc.
- Current Assignee Address: US MN Minneapolis
- Main IPC: A61N1/375
- IPC: A61N1/375 ; A61N1/04 ; A61N1/36 ; A61N1/362 ; H01R13/52 ; A61N1/05

Abstract:
A medical device includes a printed circuit board, a connector mounted on the printed circuit board, and a polymeric body molded over the connector and the printed circuit board. The connector is configured to receive a medical lead and electrically and mechanically couple the lead to the printed circuit board. The connector comprises a housing and feedthrough assembly that includes a polymeric housing and a conductor. The housing defines a bore configured to receive the lead and defines a feedthrough opening through which the conductor extends. The housing and feedthrough assembly is sealed except for an aperture in communication with the bore. The connector further includes a contact disposed in the bore. The conductor electrically couples the contact with the printed circuit board. When a lead is properly received by the bore, the contact couples the lead to the printed circuit board via the conductor.
Public/Granted literature
- US20160166825A1 MEDICAL DEVICE WITH SURFACE MOUNTED LEAD CONNECTOR Public/Granted day:2016-06-16
Information query
IPC分类: