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公开(公告)号：US20230248982A1
公开(公告)日：2023-08-10
申请号：US18102367
申请日：2023-01-27
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Mark E. Henschel , James R. Wasson , Chunho Kim , Walter E. Benecke , Kris A. Peterson , Jeff M. Wheeler , Songhua Shi
CPC classification number: A61N1/3754 , A61N1/37223
Abstract: Various embodiments of a feedthrough assembly are disclosed. The assembly includes a header and a test fanout layer electrically connected to the header. A first major surface of the test fanout layer faces an inner surface of the header. The assembly further includes a test via extending between the first major surface and a second major surface of the test fanout layer, and a test pad disposed on the first major surface of the test fanout layer and electrically connected to the test via. At least a portion of the test pad is disposed between the outer surface of the header and a perimeter of the test fanout layer as viewed in a plane parallel to the first major surface of the test fanout layer such that the at least a portion of the test pad is exposed.
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公开(公告)号：US12290693B2
公开(公告)日：2025-05-06
申请号：US17587676
申请日：2022-01-28
Applicant: Medtronic, Inc.
Inventor： Mark E. Henschel , Andrew J. Ries , Songhua Shi , Jemmy Sutanto , Lea Ann Nygren
Abstract: Various embodiments of an electronics module and an implantable medical device that includes such module are disclosed. The module includes a feedthrough header assembly having a conductive header that includes a conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the header; and a feedthrough pin disposed within a via that extends through the header. The module further includes an electronic layer having a substrate and an electronic component disposed on or within the substrate. The electronic component is electrically connected to the contact of the conductive header such that the electronic component is electrically connected to the header. A major surface of the substrate of the electronic layer faces the conductive inner surface of the header without any intervening nonconductive layers disposed between the major surface of the substrate and the conductive inner surface of the header.
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公开(公告)号：US20220241598A1
公开(公告)日：2022-08-04
申请号：US17587676
申请日：2022-01-28
Applicant: Medtronic, Inc.
Inventor： Mark E. Henschel , Andrew J. Ries , Songhua Shi , Jemmy Sutanto , Lea Ann Nygren
Abstract: Various embodiments of an electronics module and an implantable medical device that includes such module are disclosed. The module includes a feedthrough header assembly having a conductive header that includes a conductive inner surface, an outer surface, and a contact disposed on the inner surface and electrically connected to the header; and a feedthrough pin disposed within a via that extends through the header. The module further includes an electronic layer having a substrate and an electronic component disposed on or within the substrate. The electronic component is electrically connected to the contact of the conductive header such that the electronic component is electrically connected to the header. A major surface of the substrate of the electronic layer faces the conductive inner surface of the header without any intervening nonconductive layers disposed between the major surface of the substrate and the conductive inner surface of the header.
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公开(公告)号：US20190343011A1
公开(公告)日：2019-11-07
申请号：US15968928
申请日：2018-05-02
Applicant: Medtronic, Inc.
Inventor： Songhua Shi , Darrin T. Schauble , Rachel M. Day
IPC: H05K5/00 , H01R12/57 , H05K5/02 , H05K5/06 , A61B5/0492
Abstract: In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature.
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公开(公告)号：US20220077085A1
公开(公告)日：2022-03-10
申请号：US17469098
申请日：2021-09-08
Applicant: Medtronic, Inc.
Inventor： Mark E. Henschel , Songhua Shi
IPC: H01L23/00 , H01L23/48 , H01L21/768
Abstract: Various embodiments of an electronic package and an implantable medical device that includes such package are disclosed. The electronic package includes a monolithic package substrate having a first major surface and a second major surface, an integrated circuit disposed in an active region of the package substrate, and a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate. The conductive via is separated from the active region by a portion of the inactive region of the substrate.
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Patent Agency Ranking
6.发明授权公开(公告)号：US10201094B2
公开(公告)日：2019-02-05
申请号：US14561248
申请日：2014-12-05
Applicant: Medtronic, Inc.
Inventor： Chunho Kim , Songhua Shi , Mark S. Ricotta , Scott B. Sleeper , Yongqian Wang
Abstract: During a process to encapsulate electronic components and attachment interfaces thereof on a first side of a substrate of a hybrid assembly, a fluid is supplied to a trench of an encapsulation system in which the hybrid assembly is loaded, and a balancing pressure is delivered by the fluid within the trench, during the encapsulation process, to support the hybrid assembly from an opposing second side of the substrate. A regulator of a fluid supply of the system may maintain the balancing pressure, for example, being controlled by a controller of the system that is configured to estimate a pressure within a molding cavity of the system.
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公开(公告)号：US09579511B2
公开(公告)日：2017-02-28
申请号：US14570531
申请日：2014-12-15
Applicant: Medtronic, Inc.
Inventor： Mark E. Henschel , Songhua Shi
CPC classification number: A61N1/3752 , A61N1/0456 , A61N1/0472 , A61N1/0595 , A61N1/36017 , A61N1/3625 , H01R12/722 , H01R13/42 , H01R13/5224 , H01R43/24 , H01R2201/12
Abstract: A medical device includes a printed circuit board, a connector mounted on the printed circuit board, and a polymeric body molded over the connector and the printed circuit board. The connector is configured to receive a medical lead and electrically and mechanically couple the lead to the printed circuit board. The connector comprises a housing and feedthrough assembly that includes a polymeric housing and a conductor. The housing defines a bore configured to receive the lead and defines a feedthrough opening through which the conductor extends. The housing and feedthrough assembly is sealed except for an aperture in communication with the bore. The connector further includes a contact disposed in the bore. The conductor electrically couples the contact with the printed circuit board. When a lead is properly received by the bore, the contact couples the lead to the printed circuit board via the conductor.
Abstract translation: 医疗装置包括印刷电路板，安装在印刷电路板上的连接器以及模制在连接器和印刷电路板上的聚合物体。 连接器被配置为接收医用引线并将引线电连接和机械地耦合到印刷电路板。 连接器包括壳体和馈通组件，其包括聚合物壳体和导体。 壳体限定了构造成接收引线并限定了导体延伸通过的馈通开口的孔。 除了与孔连通的孔之外，壳体和馈通组件是密封的。 连接器还包括设置在孔中的接触件。 导体将触点与印刷电路板电耦合。 当引线被孔正确接收时，触点通过导体将引线连接到印刷电路板。
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公开(公告)号：US12237281B2
公开(公告)日：2025-02-25
申请号：US17469098
申请日：2021-09-08
Applicant: Medtronic, Inc.
Inventor： Mark E. Henschel , Songhua Shi
IPC: H01L21/00 , H01L21/768 , H01L23/00 , H01L23/48 , A61N1/375
Abstract: Various embodiments of an electronic package and an implantable medical device that includes such package are disclosed. The electronic package includes a monolithic package substrate having a first major surface and a second major surface, an integrated circuit disposed in an active region of the package substrate, and a conductive via disposed through an inactive region of the package substrate and extending between the first major surface and the second major surface of the package substrate. The conductive via is separated from the active region by a portion of the inactive region of the substrate.
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公开(公告)号：US10721826B2
公开(公告)日：2020-07-21
申请号：US15968928
申请日：2018-05-02
Applicant: Medtronic, Inc.
Inventor： Songhua Shi , Darrin T. Schauble , Rachel M. Day
IPC: H05K5/00 , H01R12/57 , H05K5/06 , A61B5/0492 , H05K5/02
Abstract: In some examples, a medical device may include circuitry on a circuit board, a casing, and a fill material at least partially within the casing. The casing may receive the circuit board and surround at least a portion of the circuit board. The casing may define an aperture configured to allow one or more electrical connectors of the circuit board to extend through the aperture for one or more electrical connections with one or more components outside of the casing. An outer surface of the casing may define a first portion of an outer surface of the medical device. The casing may comprise a material having a first melting temperature. The fill material may define a second portion of the outer surface of the medical device and may have a second melting temperature that is lower than the first melting temperature.
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公开(公告)号：US20160166825A1
公开(公告)日：2016-06-16
申请号：US14570531
申请日：2014-12-15
Applicant: Medtronic, Inc.
Inventor： Mark E. Henschel , Songhua Shi
IPC: A61N1/04
CPC classification number: A61N1/3752 , A61N1/0456 , A61N1/0472 , A61N1/0595 , A61N1/36017 , A61N1/3625 , H01R12/722 , H01R13/42 , H01R13/5224 , H01R43/24 , H01R2201/12
Abstract: A medical device includes a printed circuit board, a connector mounted on the printed circuit board, and a polymeric body molded over the connector and the printed circuit board. The connector is configured to receive a medical lead and electrically and mechanically couple the lead to the printed circuit board. The connector comprises a housing and feedthrough assembly that includes a polymeric housing and a conductor. The housing defines a bore configured to receive the lead and defines a feedthrough opening through which the conductor extends. The housing and feedthrough assembly is sealed except for an aperture in communication with the bore. The connector further includes a contact disposed in the bore. The conductor electrically couples the contact with the printed circuit board. When a lead is properly received by the bore, the contact couples the lead to the printed circuit board via the conductor.
Abstract translation: 医疗装置包括印刷电路板，安装在印刷电路板上的连接器以及模制在连接器和印刷电路板上的聚合物体。 连接器被配置为接收医用引线并将引线电连接和机械地耦合到印刷电路板。 连接器包括壳体和馈通组件，其包括聚合物壳体和导体。 壳体限定了构造成接收引线并限定了导体延伸通过的馈通开口的孔。 除了与孔连通的孔之外，壳体和馈通组件是密封的。 连接器还包括设置在孔中的接触件。 导体将触点与印刷电路板电耦合。 当引线被孔正确接收时，触点通过导体将引线连接到印刷电路板。
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