Invention Grant
- Patent Title: Electronic component transfer shuttle
- Patent Title (中): 电子元件传输班车
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Application No.: US14609976Application Date: 2015-01-30
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Publication No.: US09586760B2Publication Date: 2017-03-07
- Inventor: Haruki Nakajima , Hiroyuki Kikuchi , Tsuyoshi Yamashita
- Applicant: ADVANTEST CORPORATION
- Applicant Address: JP Tokyo
- Assignee: ADVANTEST CORPORATION
- Current Assignee: ADVANTEST CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Greenblum & Bernstein, P.L.C.
- Priority: JP2011-289392 20111228
- Main IPC: B65G47/00
- IPC: B65G47/00 ; B65G17/12 ; G01R31/28 ; B65G49/06 ; B65G35/06

Abstract:
There is provided an electronic device transfer apparatus which has an excellent capacity of transferring DUTs between trays.An electronic device transfer apparatus, which transfers DUTs between trays, includes a device conveying unit. The device conveying unit includes a plurality of shuttles which hold the DUTs, an endless first guide rail which guides the shuttles, and first to third feeders which move the shuttles on the first guide rail. The shuttles are movable on the first guide rail over the entire circumference of the rail.
Public/Granted literature
- US20150203300A1 ELECTRONIC COMPONENT TRANSFER SHUTTLE Public/Granted day:2015-07-23
Information query
IPC分类: