Invention Grant
- Patent Title: Semiconductor package structure and method for manufacturing the same
- Patent Title (中): 半导体封装结构及其制造方法
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Application No.: US14685529Application Date: 2015-04-13
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Publication No.: US09589871B2Publication Date: 2017-03-07
- Inventor: Tang-Yuan Chen , Chin-Li Kao , Kuo-Hua Chen , Ming-Hung Chen , Dao-Long Chen
- Applicant: Advanced Semiconductor Engineering, Inc.
- Applicant Address: TW Kaosiung
- Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- Current Assignee Address: TW Kaosiung
- Agency: Foley & Lardner LLP
- Agent Cliff Z. Liu
- Main IPC: H01L23/49
- IPC: H01L23/49 ; H01L23/495 ; H01L23/00 ; H01L23/31 ; H01L21/48 ; H01L21/56
Abstract:
The present disclosure relates to a semiconductor package structure and a method for manufacturing the same. The semiconductor package structure includes a leadframe and a semiconductor die. The leadframe includes a main portion and a protrusion portion. The semiconductor die is bonded to a first surface of the main portion. The protrusion portion protrudes from a second surface of the main portion. The position of the protrusion portion corresponds to the position of the semiconductor die.
Public/Granted literature
- US20160300782A1 SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2016-10-13
Information query
IPC分类:
