Invention Grant
US09589968B2 Method for producing one-time-programmable memory cells and corresponding integrated circuit 有权
一次性可编程存储单元的制造方法及相应的集成电路

Method for producing one-time-programmable memory cells and corresponding integrated circuit
Abstract:
An integrated circuit includes a silicon on insulator substrate having a semiconductor film located above a buried insulating layer. At least one memory cell of the one-time-programmable type includes an MOS capacitor having a first electrode region including a gate region at least partially silicided and flanked by an insulating lateral region, a dielectric layer located between the gate region and the semiconductor film, and a second electrode region including a silicided zone of the semiconductor film, located alongside the insulating lateral region and extending at least partially under the dielectric layer.
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