Invention Grant
- Patent Title: Uplink coordinated multi-point
- Patent Title (中): 上行协调多点
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Application No.: US14812927Application Date: 2015-07-29
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Publication No.: US09591638B2Publication Date: 2017-03-07
- Inventor: Debdeep Chatterjee , Kamran Etemad , Rongzhen Yang , Jong-Kae Fwu , Apostolos Papathanassiou
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H04L5/00
- IPC: H04L5/00 ; H04L27/26 ; H04B1/69 ; H04W72/04 ; H04W72/08 ; H04B7/02 ; H04B7/04 ; H04B7/06 ; H04W4/00 ; H04W4/08 ; H04L12/18 ; H04L29/06 ; H04L1/18 ; H04L5/14 ; H04W52/02 ; H04W36/00 ; H04L1/00 ; H04W76/04 ; H04W36/04

Abstract:
Disclosed embodiments may include an apparatus having one or more processors coupled to one or more computer-readable storage media. The one or more processors may be configured to transmit and/or receive channel state information reference signal (CSI-RS) resource configuration information, demodulation reference signals (DM-RS), uplink sounding reference signals (SRS), and power control parameters to support uplink coordinated multi-point (CoMP) operations. Other embodiments may be disclosed.
Public/Granted literature
- US20150341149A1 UPLINK COORDINATED MULTI-POINT Public/Granted day:2015-11-26
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