Disclosed herein are a variety of embodiments of a thermal interface material that may be used in a variety of systems and methods to improve heat transfer. One embodiment consistent with the present disclosure includes a heat dissipation system that includes a heat source and a heat sink. A thermal interface material may be at least partially disposed between the heat source and the heat sink. The thermal interface material may include a plurality of strands of thermally conductive material woven into a pattern. The thermal interface material may be configured to conform to the contact surfaces of the heat source and the heat sink to thereby increase transference of heat between the heat source and the heat sink.