Invention Grant
- Patent Title: Methods and apparatus for measuring a property of a substrate
- Patent Title (中): 用于测量基材性质的方法和装置
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Application No.: US14355962Application Date: 2012-11-22
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Publication No.: US09594029B2Publication Date: 2017-03-14
- Inventor: Wouter Lodewijk Elings , Franciscus Bernardus Maria Van Bilsen , Christianus Gerardus Maria De Mol , Everhardus Cornelis Mos , Hoite Pieter Theodoor Tolsma , Peter Ten Berge , Paul Jacques Van Wijnen , Leonardus Henricus Marie Verstappen , Gerald Dicker , Reiner Maria Jungblut , Li Chung-Hsun
- Applicant: ASML Netherlands B.V.
- Applicant Address: NL Veldhoven
- Assignee: ASML Netherlands B.V.
- Current Assignee: ASML Netherlands B.V.
- Current Assignee Address: NL Veldhoven
- Agency: Sterne, Kessler, Goldstein & Fox P.L.L.C.
- International Application: PCT/EP2012/073396 WO 20121122
- International Announcement: WO2013/092106 WO 20130627
- Main IPC: G01N21/95
- IPC: G01N21/95 ; G01B11/02 ; G01B11/14 ; G05B19/418 ; G03F7/20 ; G01N21/956 ; H01L21/66
Abstract:
In the measurement of properties of a wafer substrate, such as Critical Dimension or overlay a sampling plan is produced (2506) defined for measuring a property of a substrate, wherein the sampling plan comprises a plurality of sub-sampling plans. The sampling plan may be constrained to a predetermined fixed number of measurement points and is used (2508) to control an inspection apparatus to perform a plurality of measurements of the property of a plurality of substrates using different sub-sampling plans for respective substrates, optionally, the results are stacked (2510) to at least partially recompose the measurement results according to the sample plan.
Public/Granted literature
- US20140354969A1 Methods and Apparatus for Measuring A Property of a Substrate Public/Granted day:2014-12-04
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