Invention Grant
- Patent Title: Methods and apparatus for cleaning semiconductor wafers
- Patent Title (中): 用于清洁半导体晶片的方法和设备
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Application No.: US13133826Application Date: 2008-12-12
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Publication No.: US09595457B2Publication Date: 2017-03-14
- Inventor: Jian Wang , Sunny Voha Nuch , Liangzhi Xie , Junping Wu , Zhaowei Jia , Yunwen Huang , Zhifeng Gao , Hui Wang
- Applicant: Jian Wang , Sunny Voha Nuch , Liangzhi Xie , Junping Wu , Zhaowei Jia , Yunwen Huang , Zhifeng Gao , Hui Wang
- Applicant Address: CN Shanghai
- Assignee: ACM Research (Shanghai) Inc.
- Current Assignee: ACM Research (Shanghai) Inc.
- Current Assignee Address: CN Shanghai
- Agency: Osha Liang LLP
- International Application: PCT/CN2008/073471 WO 20081212
- International Announcement: WO2010/066081 WO 20100617
- Main IPC: H01L21/67
- IPC: H01L21/67 ; B08B3/12
Abstract:
A method for cleaning semiconductor substrate using ultra/mega sonic device comprising holding a semiconductor substrate by using a chuck, positioning a ultra/mega sonic device adjacent to the semiconductor substrate, injecting chemical liquid on the semiconductor substrate and gap between the semiconductor substrate and the ultra/mega sonic device, changing gap between the semiconductor substrate and the ultra/mega sonic device for each rotation of the chuck during the cleaning process. The gap can be increased or reduced by 0.5λ/N for each rotation of the chuck, where λ is wavelength of ultra/mega sonic wave, N is an integer number between 2 and 1000. The gap is varied in the range of 0.5λn during the cleaning process, where λ is wavelength of ultra/mega sonic wave, and n is an integer number starting from 1.
Public/Granted literature
- US20110290277A1 Methods and Apparatus for Cleaning Semiconductor Wafers Public/Granted day:2011-12-01
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