Invention Grant
- Patent Title: Wire bonded electronic devices to round wire
- Patent Title (中): 线接电子设备到圆线
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Application No.: US14928289Application Date: 2015-10-30
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Publication No.: US09595501B1Publication Date: 2017-03-14
- Inventor: Robert Neuman
- Applicant: AUTOMATED ASSEMBLY CORPORATION
- Applicant Address: US MN Lakeville
- Assignee: Automated Assembly Corporation
- Current Assignee: Automated Assembly Corporation
- Current Assignee Address: US MN Lakeville
- Agency: Crawford Maunu PLLC
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L23/49 ; H01L33/48 ; H01L33/54 ; H01L33/62 ; H01L23/00 ; H05K1/18 ; H05K3/30 ; H05K3/34 ; H05K1/11 ; H05K3/20 ; H05K1/03 ; H01L23/498 ; H01L21/56 ; H01L21/48
Abstract:
A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.
Information query
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