公开(公告)号：US09781839B1

公开(公告)日：2017-10-03

申请号：US14883302

申请日：2015-10-14

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： David Neuman ,  Robert Neuman ,  Pat Connolly ,  Brian Backes

IPC分类号： H05K3/10 ,  H05K3/32

CPC分类号： H05K3/321 ,  H05K3/10 ,  H05K3/103 ,  H05K2201/10287

摘要： A method of attaching wire to an exposed surface of an adhesive layer includes guiding wire from a wire source through a payout head and through a foot of a write head. A first portion of the wire extends from the foot toward the adhesive layer. The write head is positioned such that a gap between the foot and the exposed surface of the adhesive layer is greater than a diameter of the wire. The write head is moved in a motion parallel to the adhesive layer, and the first portion of the wire adheres to the adhesive layer. Wire is pulled from the wire source by the payout head as the write head is moving in order to maintain slack in a second portion of the wire between the payout head and the write head as the wire is attached to the exposed surface of the adhesive layer.

公开(公告)号：US20170200694A1

公开(公告)日：2017-07-13

申请号：US15427875

申请日：2017-02-08

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： Robert Neuman

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L23/498 ,  H01L23/31

CPC分类号： H05K3/32 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49883 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2224/85801 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

公开(公告)号：US10438109B1

公开(公告)日：2019-10-08

申请号：US15416628

申请日：2017-01-26

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： Robert Neuman

IPC分类号： G06K19/077 ,  G06K19/07 ,  H05K3/30 ,  H05K1/18 ,  H05K1/09 ,  H05K1/03

摘要： A disclosed circuit arrangement includes an adhesive layer on a water soluble backing, antenna wire adhered to the adhesive layer, an RF transponder disposed on the adhesive layer, and first and second cross wires attached to the adhesive layer and disposed proximate the RF transponder. The antenna wire has first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire. The first and second cross wires and the antenna wire have round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the RF transponder and to the first portion of the antenna wire, and a second bond wire is connected to the RF transponder and to the second portion of the antenna wire.

公开(公告)号：US09431363B1

公开(公告)日：2016-08-30

申请号：US14553519

申请日：2014-11-25

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： Scott Lindblad ,  David Neuman ,  Robert Neuman

IPC分类号： H01L29/30 ,  H01L23/00

CPC分类号： H01L24/46 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07783 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/62 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48472 ,  H01L2224/48997 ,  H01L2224/4903 ,  H01L2224/4905 ,  H01L2224/4911 ,  H01L2224/494 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/0782 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/19107 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, and one or more round wire segments attached to the substrate. The one or more round wire segments have first and second portions for connecting to the IC component, and each first and second portion has a planar landing area extending longitudinally along the wire. The circuit arrangement further includes bond wires connecting the landing areas to the IC component.

摘要翻译： 电路装置包括衬底，附着到衬底的集成电路（IC）部件和附接到衬底的一个或多个圆形线段。 一个或多个圆形线段具有用于连接到IC部件的第一和第二部分，并且每个第一和第二部分具有沿着线纵向延伸的平面着陆区域。 电路装置还包括将着陆区域连接到IC部件的接合线。

公开(公告)号：US08893976B1

公开(公告)日：2014-11-25

申请号：US13945016

申请日：2013-07-18

申请人： Automated Assembly Corporation

发明人： Scott Lindblad ,  David Neuman ,  Robert Neuman

IPC分类号： G06K19/02 ,  G06K19/077

CPC分类号： G06K19/07798 ,  B60R2325/105 ,  G08G1/017 ,  G09F3/0292 ,  G09F3/0297

摘要： A tamper-resistant electronic system includes a destructible vinyl (DV) substrate having conductive wiring disposed on a first surface of the DV substrate. An RFID device has pins mechanically and electrically connected to the wiring on the first surface of the DV substrate. A plate has a first surface, and a portion of the first surface of the plate is adhered to a portion of the first surface of the DV substrate. The plate has a cavity that encompasses the RFID device. A backing is adhered to a second surface of the plate opposite the first surface of the plate.

摘要翻译： 防篡改电子系统包括具有设置在DV基板的第一表面上的导电布线的可破坏乙烯基（DV）基板。 RFID设备具有机械地和电连接到DV基板的第一表面上的布线的引脚。 板具有第一表面，并且板的第一表面的一部分粘附到DV基板的第一表面的一部分。 该板具有包围RFID装置的空腔。 背衬粘附到板的与板的第一表面相对的第二表面。

公开(公告)号：US09900992B1

公开(公告)日：2018-02-20

申请号：US15401143

申请日：2017-01-09

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： Robert Neuman

IPC分类号： H01L33/62 ,  H05K3/32

CPC分类号： H05K3/32 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49883 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2224/85801 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A disclosed circuit arrangement includes adhesive transfer tape having a layer of pressure sensitive adhesive (PSA) having a first major surface and a second major surface opposite the first major surface. One or more metal foil pads are attached directly to the second major surface of the layer of PSA. Electrically conductive round wire is attached directly to the second major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly to the second major surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

公开(公告)号：US09870529B1

公开(公告)日：2018-01-16

申请号：US15416664

申请日：2017-01-26

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： Robert Neuman

IPC分类号： G06K19/06 ,  G06K19/077 ,  H05K1/18 ,  H05K1/11 ,  H05K3/40 ,  H05K3/32 ,  H05K3/28

CPC分类号： G06K19/0775 ,  G06K19/07747 ,  H05K1/111 ,  H05K1/181 ,  H05K3/28 ,  H05K3/32 ,  H05K3/328 ,  H05K3/4007 ,  H05K2201/10098

摘要： A disclosed transponder arrangement includes a water soluble backing having first and second major surfaces. A layer of pressure sensitive adhesive (PSA) has a third major surface and a fourth major surface. The fourth major surface is directly adhered to the first major surface of the water soluble backing. One or more metal foil pads are attached directly on the third major surface of the layer of PSA. Electrically conductive round wire is attached directly on the third major surface of the layer of PSA. The wire has a round cross-section and one or more portions directly connected to the metal foil pad(s) with weld joint(s). An RF transponder is attached directly on the third major surface of the first layer of PSA and is electrically connected to the one or more portions of the round wire by bond wire(s).

公开(公告)号：US09595501B1

公开(公告)日：2017-03-14

申请号：US14928289

申请日：2015-10-30

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： Robert Neuman

IPC分类号： H01L23/31 ,  H01L23/49 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L23/00 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K1/11 ,  H05K3/20 ,  H05K1/03 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

CPC分类号： H05K3/32 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49883 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2224/85801 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

摘要： A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

摘要翻译： 所公开的电路装置包括柔性基板。 压敏粘合剂层（PSA）直接粘附到基材的第一主表面。 一个或多个金属箔垫和导电线直接附着在PSA层的表面上。 导线具有圆形横截面，并且一个或多个部分分别直接连接到具有一个或多个焊接接头的一个或多个金属箔垫。 电子器件直接附着在PSA层的表面上，并分别通过一根或多根接合线与圆形线的一个或多个部分电连接。

公开(公告)号：US09565752B1

公开(公告)日：2017-02-07

申请号：US14737268

申请日：2015-06-11

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： Robert Neuman ,  Scott Lindblad

IPC分类号： H01Q1/00 ,  H05K1/02 ,  H01Q1/50 ,  F21V23/00 ,  H05K1/03 ,  H05K1/09 ,  F21K99/00 ,  H05K3/10 ,  H05K3/32 ,  F21Y101/02

CPC分类号： H05K1/028 ,  F21Y2115/10 ,  H01Q1/2208 ,  H01Q7/00 ,  H05K1/032 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/103 ,  H05K3/32 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2203/049

摘要： A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to the substrate and disposed proximate the electronic device, and one or more wire segments attached to the substrate. The one or more wire segments have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments are round wires having round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire is connected to the electronic device and to the second portion of the one or more wire segments.

摘要翻译： 所公开的电路装置包括衬底，附着到衬底的集成电路（IC）部件，附接到衬底并设置在电子器件附近的第一和第二交叉线以及附接到衬底的一个或多个线段。 一个或多个线段具有分别在第一十字线的第三部分和第二十字线的第四部分附接的第一和第二部分。 第一和第二十字线和一个或多个线段是具有圆形横截面的圆形线。 第一部分和第三部分具有平坦的接触区域，并且第二和第四部分具有平坦的接触区域。 第一接合线连接到电子设备和一个或多个线段的第一部分，并且第二接合线连接到电子设备和一个或多个线段的第二部分。

公开(公告)号：US10381325B1

公开(公告)日：2019-08-13

申请号：US15668870

申请日：2017-08-04

申请人： AUTOMATED ASSEMBLY CORPORATION

发明人： Kimmo Kyllonen ,  Robert Neuman

IPC分类号： H01L23/52 ,  H01L23/00 ,  B23K20/00

摘要： A disclosed circuit arrangement includes a support structure having first and second posts. Electrically conductive round wire has a round cross-section, and a first portion is wrapped at least partially around the first post. A second portion of the wire extends in a straight line from a point on a perimeter of the first post to a point on a perimeter of the second post, and a third portion of the wire is wrapped at least partially around the second post. The second portion of the round wire defines one or more bond sites. An electronic device is electrically connected to the round wire at one of the one or more bond sites.