Invention Grant
- Patent Title: Aluminum oxide landing layer for conductive channels for a three dimensional circuit device
- Patent Title (中): 用于三维电路器件的导电通道的氧化铝着层层
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Application No.: US14329644Application Date: 2014-07-11
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Publication No.: US09595531B2Publication Date: 2017-03-14
- Inventor: Hongbin Zhu , Gordon A Haller , Fatma A Simsek-Ege
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Compass IP Law
- Main IPC: H01L29/80
- IPC: H01L29/80 ; H01L27/115

Abstract:
A multitier stack of memory cells having an aluminum oxide (AlOx) layer as a noble HiK layer to provide etch stop selectivity. Each tier of the stack includes a memory cell device. The circuit includes a source gate select polycrystalline (SGS poly) layer adjacent the multitier stack of memory cells, wherein the SGS poly layer is to provide a gate select signal for the memory cells of the multitier stack. The circuit also includes a conductive source layer to provide a source conductor for a channel for the tiers of the stack. The AlOx layer is disposed between the source layer and the SGS poly layer and provides both dry etch selectivity and wet etch selectivity for creating a channel to electrically couple the memory cells to the source layer.
Public/Granted literature
- US20160133640A1 ALUMINUM OXIDE LANDING LAYER FOR CONDUCTIVE CHANNELS FOR A THREE DIMENSIONAL CIRCUIT DEVICE Public/Granted day:2016-05-12
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