Invention Grant
US09595579B2 Dual shallow trench isolation (STI) structure for field effect transistor (FET)
有权
场效应晶体管(FET)的双浅沟槽隔离(STI)结构
- Patent Title: Dual shallow trench isolation (STI) structure for field effect transistor (FET)
- Patent Title (中): 场效应晶体管(FET)的双浅沟槽隔离(STI)结构
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Application No.: US14712397Application Date: 2015-05-14
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Publication No.: US09595579B2Publication Date: 2017-03-14
- Inventor: Natalie B. Feilchenfeld , Max G. Levy , Richard A. Phelps , Santosh Sharma , Yun Shi , Michael J. Zierak
- Applicant: GLOBALFOUNDRIES INC.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES INC.
- Current Assignee: GLOBALFOUNDRIES INC.
- Current Assignee Address: KY Grand Cayman
- Agency: Hoffman Warnick LLC
- Agent Michael LeStrange
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/06 ; H01L21/762 ; H01L29/10 ; H01L29/66 ; H01L29/423 ; H01L29/08

Abstract:
Various embodiments include structures for field effect transistors (FETs). In various embodiments, a structure for a FET includes: a deep n-type well; a shallow n-type well within the deep n-type well; and a shallow trench isolation (STI) region within the shallow n-type well, the STI region including: a first section having a first depth within the shallow n-type well as measured from an upper surface of the shallow n-type well, and a second section contacting and overlying the first section, the second section having a second depth within the shallow n-type well as measured from the upper surface of the shallow n-type well.
Public/Granted literature
- US20150255539A1 DUAL SHALLOW TRENCH ISOLATION (STI) FIELD EFFECT TRANSISTOR (FET) AND METHODS OF FORMING Public/Granted day:2015-09-10
Information query
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