Invention Grant
- Patent Title: Method for fabricating bump structure without UBM undercut
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Application No.: US12761863Application Date: 2010-04-16
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Publication No.: US09598772B2Publication Date: 2017-03-21
- Inventor: Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Chung-Shi Liu
- Applicant: Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Chung-Shi Liu
- Applicant Address: TW
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW
- Agency: Hauptman Ham, LLP
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L21/3205 ; C23C18/16 ; H01L23/00 ; H01L23/31
Abstract:
A method for fabricating bump structure without UBM undercut uses an electroless Cu plating process to selectively form a Cu UBM layer on a Ti UBM layer within an opening of a photoresist layer. After stripping the photoresist layer, there is no need to perform a wet etching process on the Cu UBM layer, and thereby the UBM structure has a non-undercut profile.
Public/Granted literature
- US20110254151A1 METHOD FOR FABRICATING BUMP STRUCTURE WITHOUT UBM UNDERCUT Public/Granted day:2011-10-20
Information query
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