- Patent Title: Highly integrated scalable, flexible DSP megamodule architecture
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Application No.: US14331986Application Date: 2014-07-15
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Publication No.: US09606803B2Publication Date: 2017-03-28
- Inventor: Timothy D. Anderson , Joseph Zbiciak , Duc Quang Bui , Abhijeet A. Chachad , Kai Chirca , Naveen Bhoria , Matthew D. Pierson , Daniel Wu , Ramakrishnan Venkatasubramanian
- Applicant: Texas Instruments Incorporated
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Robert D. Marshall, Jr.; Charles A. Brill; Frank D. Cimino
- Main IPC: G06F9/00
- IPC: G06F9/00 ; G06F15/76 ; G06F11/00 ; G06F9/345 ; G06F9/30 ; G06F9/38 ; G06F11/10

Abstract:
This invention addresses implements a range of interesting technologies into a single block. Each DSP CPU has a streaming engine. The streaming engines include: a SE to L2 interface that can request 512 bits/cycle from L2; a loose binding between SE and L2 interface, to allow a single stream to peak at 1024 bits/cycle; one-way coherence where the SE sees all earlier writes cached in system, but not writes that occur after stream opens; full protection against single-bit data errors within its internal storage via single-bit parity with semi-automatic restart on parity error.
Public/Granted literature
- US20150019840A1 Highly Integrated Scalable, Flexible DSP Megamodule Architecture Public/Granted day:2015-01-15
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