Invention Grant
- Patent Title: Embedded universal serial bus solutions
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Application No.: US14457594Application Date: 2014-08-12
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Publication No.: US09606955B2Publication Date: 2017-03-28
- Inventor: Huimin Chen , Jia Jun Lee , Amit Kumar Srivastava , Teong Guan T. G. Yew , Tim McKee
- Applicant: INTEL CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: International IP Law Group, P.L.L.C.
- Main IPC: G06F13/20
- IPC: G06F13/20 ; G06F13/42 ; G06F13/38

Abstract:
Techniques for embedded high speed serial interface methods are described herein. The method includes issuing a single-ended one (SE1) signal on each of a pair of embedded high speed serial interface data lines, the SE1 indicating a register access protocol (RAP) message follows the SE1 signal. The method also includes accessing a register of an embedded high speed serial interface component based on the RAP message.
Public/Granted literature
- US20150227489A1 Embedded Universal Serial Bus Solutions Public/Granted day:2015-08-13
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