Invention Grant
- Patent Title: Package structure and fabrication method thereof
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Application No.: US14940554Application Date: 2015-11-13
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Publication No.: US09607974B2Publication Date: 2017-03-28
- Inventor: Chun-Tang Lin , Shih-Ching Chen , Yi-Che Lai , Hong-Da Chang , Hung-Wen Liu , Yi-Wei Liu , Hsi-Chang Hsu
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee: Siliconware Precision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW103139710A 20141117
- Main IPC: H01L25/00
- IPC: H01L25/00 ; H01L25/065 ; H01L21/683 ; H01L23/31 ; H01L21/56 ; H01L23/00

Abstract:
A method for fabricating a package structure is provided, which includes: providing a first carrier having a circuit layer thereon; forming a plurality of conductive posts on the circuit layer and disposing at least an electronic element on the first carrier; forming an encapsulant on the first carrier to encapsulate the conductive posts, the circuit layer and the electronic element; and removing the first carrier, thereby dispensing with the conventional hole opening process for forming the conductive posts and hence reducing the fabrication costs.
Public/Granted literature
- US20160141227A1 PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF Public/Granted day:2016-05-19
Information query
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