公开(公告)号：US09666536B2

公开(公告)日：2017-05-30

申请号：US14956758

申请日：2015-12-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yi-Wei Liu ,  Yan-Heng Chen ,  Mao-Hua Yeh ,  Hung-Wen Liu ,  Yi-Che Lai

IPC: H01L21/4763 ,  H01L23/538 ,  H01L21/683 ,  H01L21/56 ,  H01L21/78 ,  H01L21/3105 ,  H01L23/498 ,  H01L21/48 ,  H01L25/00 ,  H01L23/00 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L21/31053 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15311

Abstract: The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming a dielectric layer on the metal layer; forming a plurality of conductive pillars embedded into the dielectric layer and protruding from a surface of the dielectric layer, and disposing an electronic component on the surface of the dielectric layer; forming an encapsulating layer on the dielectric layer to encompass the plurality of conductive pillars, the dielectric layer and the electronic component; removing a portion of the encapsulating layer and the first carrier such that two ends of each of the plurality of conductive pillars are exposed from the encapsulating layer and the dielectric layer. Therefore, the present invention effectively reduces manufacturing costs and the need for an opening process while manufacturing the conductive pillars can be eliminated.

公开(公告)号：US09607974B2

公开(公告)日：2017-03-28

申请号：US14940554

申请日：2015-11-13

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chun-Tang Lin ,  Shih-Ching Chen ,  Yi-Che Lai ,  Hong-Da Chang ,  Hung-Wen Liu ,  Yi-Wei Liu ,  Hsi-Chang Hsu

IPC: H01L25/00 ,  H01L25/065 ,  H01L21/683 ,  H01L23/31 ,  H01L21/56 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for fabricating a package structure is provided, which includes: providing a first carrier having a circuit layer thereon; forming a plurality of conductive posts on the circuit layer and disposing at least an electronic element on the first carrier; forming an encapsulant on the first carrier to encapsulate the conductive posts, the circuit layer and the electronic element; and removing the first carrier, thereby dispensing with the conventional hole opening process for forming the conductive posts and hence reducing the fabrication costs.

公开(公告)号：US20160190099A1

公开(公告)日：2016-06-30

申请号：US14956758

申请日：2015-12-02

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yi-Wei Liu ,  Yan-Heng Chen ,  Mao-Hua Yeh ,  Hung-Wen Liu ,  Yi-Che Lai

IPC: H01L25/065 ,  H01L21/48 ,  H01L21/56 ,  H01L23/538 ,  H01L25/00 ,  H01L21/78 ,  H01L21/3105 ,  H01L23/31 ,  H01L21/683 ,  H01L21/768

CPC classification number: H01L23/5389 ,  H01L21/31053 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15311

Abstract: The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming a dielectric layer on the metal layer; forming a plurality of conductive pillars embedded into the dielectric layer and protruding from a surface of the dielectric layer, and disposing an electronic component on the surface of the dielectric layer; forming an encapsulating layer on the dielectric layer to encompass the plurality of conductive pillars, the dielectric layer and the electronic component; removing a portion of the encapsulating layer and the first carrier such that two ends of each of the plurality of conductive pillars are exposed from the encapsulating layer and the dielectric layer. Therefore, the present invention effectively reduces manufacturing costs and the need for an opening process while manufacturing the conductive pillars can be eliminated.

Abstract translation: 本发明提供一种封装结构及其制造方法。 该方法包括提供具有金属层的第一载体; 在所述金属层上形成电介质层; 形成嵌入介电层并从电介质层的表面突出的多个导电柱，并在电介质层的表面上设置电子部件; 在所述电介质层上形成封装层以包围所述多个导电柱，所述电介质层和所述电子部件; 去除封装层和第一载体的一部分，使得多个导电柱中的每一个的两端从封装层和电介质层露出。 因此，本发明有效地降低了制造成本，并且可以消除在制造导电柱的过程中对打开过程的需要。

公开(公告)号：US20170236783A1

公开(公告)日：2017-08-17

申请号：US15581799

申请日：2017-04-28

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Yi-Wei Liu ,  Yan-Heng Chen ,  Mao-Hua Yeh ,  Hung-Wen Liu ,  Yi-Che Lai

IPC: H01L23/538 ,  H01L25/00 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L25/10

CPC classification number: H01L23/5389 ,  H01L21/31053 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/3114 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68318 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/12105 ,  H01L2224/16235 ,  H01L2225/06517 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15311

Abstract: The present invention provides a package structure and fabrication method thereof. The method includes providing a first carrier having a metal layer; forming a dielectric layer on the metal layer; forming a plurality of conductive pillars embedded into the dielectric layer and protruding from a surface of the dielectric layer, and disposing an electronic component on the surface of the dielectric layer; forming an encapsulating layer on the dielectric layer to encompass the plurality of conductive pillars, the dielectric layer and the electronic component; removing a portion of the encapsulating layer and the first carrier such that two ends of each of the plurality of conductive pillars are exposed from the encapsulating layer and the dielectric layer. Therefore, the present invention effectively reduces manufacturing costs and the need for an opening process while manufacturing the conductive pillars can be eliminated.

公开(公告)号：US20160141227A1

公开(公告)日：2016-05-19

申请号：US14940554

申请日：2015-11-13

Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.

Inventor： Chun-Tang Lin ,  Shih-Ching Chen ,  Yi-Che Lai ,  Hong-Da Chang ,  Hung-Wen Liu ,  Yi-Wei Liu ,  Hsi-Chang Hsu

IPC: H01L23/48 ,  H01L23/528 ,  H01L25/00 ,  H01L21/56 ,  H01L21/683 ,  H01L21/768 ,  H01L23/31 ,  H01L25/065

CPC classification number: H01L25/50 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/48 ,  H01L24/96 ,  H01L25/0657 ,  H01L25/105 ,  H01L2221/68359 ,  H01L2221/68372 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/06548 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method for fabricating a package structure is provided, which includes: providing a first carrier having a circuit layer thereon; forming a plurality of conductive posts on the circuit layer and disposing at least an electronic element on the first carrier; forming an encapsulant on the first carrier to encapsulate the conductive posts, the circuit layer and the electronic element; and removing the first carrier, thereby dispensing with the conventional hole opening process for forming the conductive posts and hence reducing the fabrication costs.

Abstract translation: 提供一种制造封装结构的方法，其包括：提供其上具有电路层的第一载体; 在所述电路层上形成多个导电柱，并且至少在所述第一载体上布置电子元件; 在所述第一载体上形成密封剂以封装所述导电柱，所述电路层和所述电子元件; 并且移除第一载体，从而分配用于形成导电柱的传统开孔工艺，从而降低制造成本。