Invention Grant
- Patent Title: Light emitting device
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Application No.: US15273298Application Date: 2016-09-22
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Publication No.: US09608180B2Publication Date: 2017-03-28
- Inventor: Daisuke Iwakura
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan-shi
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan-shi
- Agency: Foley & Lardner LLP
- Priority: JP2013-137500 20130628
- Main IPC: H01L33/54
- IPC: H01L33/54 ; H01L33/50 ; H01L33/62

Abstract:
A light emitting device comprises a package having a recess; a light emitting element mounted in the recess of the package; a light transmissive member provided above the light emitting element; a sealing resin that seals the recess of the package; and a fluorescent material contained in the sealing resin. The fluorescent material is distributed to a side of the light emitting element in a greater amount than to above the light emitting element, a side surface of the light emitting element is exposed to the sealing resin, and a portion of the light transmissive member protrudes from the sealing resin.
Public/Granted literature
- US20170012185A1 LIGHT EMITTING DEVICE Public/Granted day:2017-01-12
Information query
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