Invention Grant
- Patent Title: Wire saw
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Application No.: US14767539Application Date: 2013-11-25
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Publication No.: US09616511B2Publication Date: 2017-04-11
- Inventor: Hyoung Jae Kim , Hyung Ho Jo , Sang Jik Lee , Do Yeon Kim , Tae Kyung Lee , Chul Jin Park
- Applicant: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Applicant Address: KR Chungcheongnam-Do
- Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Current Assignee: KOREA INSTITUTE OF INDUSTRIAL TECHNOLOGY
- Current Assignee Address: KR Chungcheongnam-Do
- Agency: IPLA P.A.
- Agent James E. Bame
- Priority: KR10-2013-0031668 20130325
- International Application: PCT/KR2013/010743 WO 20131125
- International Announcement: WO2014/157805 WO 20141002
- Main IPC: B23D57/00
- IPC: B23D57/00 ; B28D5/04 ; B28D7/04

Abstract:
Provided is a wire saw (1) that cuts an ingot (I) while swinging the ingot. The wire saw (1) includes a first driving block (100), a second driving block (110), and an ingot holder (120). When the first driving block (100) moves, the second driving block (110) moves in a direction perpendicular to a moving direction of the first driving block (100), and simultaneously the ingot holder (120) is swung. The ingot holder (120) is transferred to a z-axial direction in which the ingot is cut by a lifting block (73), and the lifting block (73) moves independently of the first or second driving block (100 or 1110). Thus, the ingot (I) can be swung separately from the lifting block (73), and be inhibited from moving left and right. Since only the first driving block (100) is controlled, easy control and a simple structure are provided.
Public/Granted literature
- US20150375317A1 WIRE SAW Public/Granted day:2015-12-31
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