- 专利标题: Power semiconductor device and method of manufacturing the same
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申请号: US14301328申请日: 2014-06-10
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公开(公告)号: US09627470B2公开(公告)日: 2017-04-18
- 发明人: In Hyuk Song , Jae Hoon Park , Kee Ju Um , Dong Soo Seo
- 申请人: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- 申请人地址: KR Suwon-Si
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon-Si
- 代理机构: Ladas & Parry, LLP
- 优先权: KR10-2013-0094957 20130809
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/739 ; H01L29/10
摘要:
There is provided a power semiconductor device including: a first semiconductor region of a first conductivity type; second semiconductor regions formed in the first semiconductor region and being of a second conductivity type; a well region formed above the second semiconductor regions and being of the second conductivity type; and a source region formed in the well region and being of the first conductivity type, wherein the second semiconductor regions include 1 to n layers formed from a lower portion of the device extending a in a direction of height of the device, and in the case that the widest width of the of the second semiconductor region of the nth layer is Pn, P1
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