Invention Grant
- Patent Title: Power semiconductor device and method of manufacturing the same
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Application No.: US14301328Application Date: 2014-06-10
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Publication No.: US09627470B2Publication Date: 2017-04-18
- Inventor: In Hyuk Song , Jae Hoon Park , Kee Ju Um , Dong Soo Seo
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-Si
- Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee: Samsung Electro-Mechanics Co., Ltd.
- Current Assignee Address: KR Suwon-Si
- Agency: Ladas & Parry, LLP
- Priority: KR10-2013-0094957 20130809
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L29/06 ; H01L29/66 ; H01L29/78 ; H01L29/739 ; H01L29/10

Abstract:
There is provided a power semiconductor device including: a first semiconductor region of a first conductivity type; second semiconductor regions formed in the first semiconductor region and being of a second conductivity type; a well region formed above the second semiconductor regions and being of the second conductivity type; and a source region formed in the well region and being of the first conductivity type, wherein the second semiconductor regions include 1 to n layers formed from a lower portion of the device extending a in a direction of height of the device, and in the case that the widest width of the of the second semiconductor region of the nth layer is Pn, P1
Public/Granted literature
- US20150041884A1 POWER SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2015-02-12
Information query
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