Invention Grant
- Patent Title: Semiconductor component and method of producing a semiconductor component
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Application No.: US15146984Application Date: 2016-05-05
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Publication No.: US09634207B2Publication Date: 2017-04-25
- Inventor: Michael Kruppa , Simon Jerebic
- Applicant: OSRAM Opto Semiconductors GmbH
- Applicant Address: DE
- Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee: OSRAM Opto Semiconductors GmbH
- Current Assignee Address: DE
- Agency: DLA Piper LLP (US)
- Priority: DE102010024545 20100622
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/58 ; H01L33/50 ; H01L33/48 ; H01L33/52 ; B29D11/00 ; G02B1/04 ; H01L33/54 ; H01L33/56 ; G02B27/09 ; H01L33/62
Abstract:
A method of producing a semiconductor component includes providing an optoelectronic semiconductor chip; applying a molding compound for an optical element, wherein the molding compound is based on a highly refractive polymer material; precuring the molding compound at a temperature of at most 50° C.; and curing the molding compound.
Public/Granted literature
- US20160247986A1 SEMICONDUCTOR COMPONENT AND METHOD OF PRODUCING A SEMICONDUCTOR COMPONENT Public/Granted day:2016-08-25
Information query
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