-
公开(公告)号：US10217915B2
公开(公告)日：2019-02-26
申请号：US15730214
申请日：2017-10-11
IPC分类号： H01L33/60 , H01L33/46 , H01L23/29 , H01L23/31 , H01L23/00 , H01L25/075 , H01L31/0232 , H01L33/54 , H01L33/62 , H01L25/16 , H01L23/60 , H01L33/56
摘要： An optoelectronic semiconductor device includes a carrier having a carrier top side, at least one optoelectronic semiconductor chip arranged at the carrier top side and having a radiation main side remote from the carrier top side, at least one bonding wire, at least one covering body on the radiation main side, and at least one reflective potting compound surrounding the semiconductor chip in a lateral direction and extending from the carrier top side at least as far as the radiation main side, wherein the bonding wire is completely covered by the reflective potting compound or completely covered by the reflective potting compound and the covering body, the bonding wire is fixed to the semiconductor chip in an electrical connection region on the radiation main side, and the electrical connection region is free of the covering body and covered partly or completely by the reflective potting compound.
-
公开(公告)号：US09236546B2
公开(公告)日：2016-01-12
申请号：US14682258
申请日：2015-04-09
发明人： Markus Maute , Jürgen Moosburger , Simon Jerebic
CPC分类号： H01L33/60 , H01L33/20 , H01L33/44 , H01L33/48 , H01L33/486 , H01L33/501 , H01L33/56 , H01L2933/0091
摘要： An optoelectronic component includes a carrier; a semiconductor chip having an active layer that generates radiation and is arranged on a carrier; a dispersed material including a matrix material and particles embedded therein arranged on the semiconductor chip and/or the carrier at least in regions, and is integral therewith; and a separating edge between the dispersed material and matrix material formed at a chip edge of the semiconductor chip.
摘要翻译： 光电子部件包括载体; 半导体芯片，具有产生辐射并且被布置在载体上的有源层; 包括基质材料和嵌入其中的颗粒的分散材料，其至少在区域中布置在半导体芯片和/或载体上，并与其成为一体; 以及形成在半导体芯片的芯片边缘处的分散材料和基质材料之间的分离边缘。
-
公开(公告)号：US20190386186A1
公开(公告)日：2019-12-19
申请号：US16485412
申请日：2018-03-01
发明人： Markus Pindl , Simon Jerebic
摘要： A method for producing optoelectronic semiconductor components is disclosed. In an embodiment a method includes A) applying radiation-emitting semiconductor chips to an intermediate carrier, wherein the semiconductor chips are volume emitters configured to emit radiation at light exit main sides and on chip side surfaces; B) applying a clear potting permeable to the radiation directly onto the chip side surfaces so that the chip side surfaces are predominantly or completely covered by the clear potting and a thickness of the clear potting in each case decreases monotonically in a direction away from the main light exit sides; C) producing a reflection element so that the reflection element and the clear potting touch on an outer side of the clear potting opposite the chip side surfaces; and D) detaching the semiconductor chips from the intermediate carrier and attaching the semiconductor chips to a component carrier so that the light exit main sides of the semiconductor chips face away from the component carrier.
-
公开(公告)号：US09209367B2
公开(公告)日：2015-12-08
申请号：US14410956
申请日：2013-06-18
发明人： Markus Boss , Markus Pindl , Tobias Gebuhr , Simon Jerebic , Martin Brandl
IPC分类号： H01L33/00 , H01L33/54 , H01L33/48 , H01L33/62 , H01L21/56 , H01L21/78 , H01L23/29 , H01L23/498 , H01L33/58
CPC分类号： H01L33/54 , H01L21/565 , H01L21/78 , H01L23/29 , H01L23/49811 , H01L23/49861 , H01L33/486 , H01L33/58 , H01L33/62 , H01L2224/48091 , H01L2224/73265 , H01L2933/005 , H01L2924/00014
摘要： An electrical component includes a closed lead frame with a passage opening at least one electrical component arranged within the passage opening, the electrical component including a first contact pad on one side of the electrical component and a second contact pad on a second side of the electric component, wherein the second side faces the first side and the second contact pad is electrically coupled to the lead frame; and an encapsulation which mechanically couples the electrical component to the lead frame, wherein the lead frame includes a recess on one side, the recess extending from an edge of the lead frame to the passage opening and connecting at least one electrical connecting element from the edge of the lead frame to the component arranged in the passage opening.
摘要翻译： 电气部件包括具有通道开口的封闭引线框架，所述通道开口至少设置在通道开口内的电气部件，所述电气部件包括在所述电气部件的一侧上的第一接触焊盘和所述电气部件的第二侧上的第二接触焊盘 其中所述第二侧面向所述第一侧，并且所述第二接触焊盘电耦合到所述引线框架; 以及封装，其将所述电气部件机械耦合到所述引线框架，其中所述引线框架包括在一侧上的凹部，所述凹部从所述引线框架的边缘延伸到所述通道开口，并且将至少一个电连接元件从所述边缘 引导框架布置在通道开口中的部件。
-
公开(公告)号：US10115869B2
公开(公告)日：2018-10-30
申请号：US15030359
申请日：2014-10-14
发明人： Mathias Kaempf , Simon Jerebic , Ingo Neudecker , Guenter Spath , Michael Huber
IPC分类号： H01L33/00 , H01L33/48 , H01L33/20 , H01L23/00 , H01L33/54 , H01L33/56 , H01L33/60 , H01L33/62
摘要： The invention relates to an optoelectronic semiconductor chip (10) comprising a carrier (2) and a semiconductor body (1) having an active layer (13) provided for generating electromagnetic radiation. Said carrier (2) has a first main surface (2A) facing the semiconductor body, a second main surface (2B) facing away from the semiconductor body, and a sidewall (2C) arranged between the first main surface and the second main surface. The carrier (2) has a structured region (21, 22, 23, 2C) for enlarging the total surface area of the sidewall, wherein the structured region has singulation traces. The invention also relates to an optoelectronic component (100) comprising such a semiconductor chip and a method for producing a plurality of such semiconductor chips are specified.
-
公开(公告)号：US10026710B2
公开(公告)日：2018-07-17
申请号：US15589427
申请日：2017-05-08
发明人： Thomas Bemmerl , Simon Jerebic , Markus Pindl
IPC分类号： H05K7/00 , H01L23/00 , H01L33/62 , H01L33/54 , H01L33/60 , H01L33/50 , H01L33/56 , H01L33/32 , H01L33/06 , H01L23/31 , H01L21/56 , H01L25/16
CPC分类号： H01L24/32 , H01L21/56 , H01L23/3142 , H01L24/83 , H01L25/167 , H01L33/06 , H01L33/32 , H01L33/44 , H01L33/507 , H01L33/54 , H01L33/56 , H01L33/58 , H01L33/60 , H01L33/62 , H01L2224/29101 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83951 , H01L2924/12041 , H01L2924/1434 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2933/005 , H01L2933/0066 , H01L2933/0091 , H05K7/02 , H01L2924/00 , H01L2924/014
摘要： An electronic arrangement comprising: a carrier; at least one connecting area on the carrier; at least one electronic component, which is fixed at least on the connecting area by a contact material; a covering area, which surrounds the connecting area on the carrier; and at least one covered region covered by a covering material; wherein the covering area is highly reflective with a reflectivity of greater than 70%, exposed regions on the connecting area and on the contact material are covered with the covering material, and the covering material is colored by titanium dioxide particles in such a way that the titanium dioxide particles are provided in the covering material in a proportion between 25 percent and 70 percent by weight, such that the covering material is highly reflective with a reflectivity of greater than 70% to minimize optical contrast between the covering area and the covered region.
-
公开(公告)号：US20160233200A1
公开(公告)日：2016-08-11
申请号：US15025759
申请日：2014-10-15
发明人： Markus Pindl , Simon Jerebic , Tobias Geltl
摘要： A method for producing an optoelectronic component is disclosed. In various embodiments, the method includes arranging a plurality of optoelectronic semiconductor chips on a carrier and commonly compressing separate molding compounds in areas of the optoelectronic semiconductor chips, wherein separate molded bodies are formed in the areas of the optoelectronic semiconductor chips.
摘要翻译： 公开了一种用于制造光电子部件的方法。 在各种实施例中，该方法包括在载体上布置多个光电子半导体芯片，并且通常在光电子半导体芯片的区域中压缩单独的模制化合物，其中在光电子半导体芯片的区域中形成分开的模制体。
-
8.发明申请METHOD OF PRODUCING A CONVERTER ELEMENT AND AN OPTOELECTRONIC COMPONENT, CONVERTER ELEMENT AND OPTOELECTRONIC COMPONENT 审中-公开生产转换器元件和光电元件，转换器元件和光电元件的方法公开(公告)号：US20160181483A1
公开(公告)日：2016-06-23
申请号：US14908257
申请日：2014-07-30
发明人： Boris Eichenberg , Herbert Brunner , Simon Jerebic
IPC分类号： H01L33/50
CPC分类号： H01L33/505 , H01L2933/0041
摘要： A method of producing a converter element for an optoelectronic component includes arranging a plurality of converter laminae on a carrier, forming a molded body, wherein the converter laminae are embedded into the molded body, and top sides and undersides of the converter laminae remain at least partly not covered by the molded body; and dividing the molded body to obtain a converter element.
摘要翻译： 一种制造用于光电子部件的转换器元件的方法包括在载体上布置多个转换器层，形成模制体，其中转换器层被嵌入到模制体中，并且转换器层的顶侧和下侧保持至少 部分不被成型体覆盖; 并分割成型体以获得转化元件。
-
公开(公告)号：US20190184407A1
公开(公告)日：2019-06-20
申请号：US16221350
申请日：2018-12-14
CPC分类号： B03D1/1456 , B01F5/16
摘要： A device for slurrying a suspension and a method for operating such a device are disclosed. In an embodiment a device includes a mixing container with an inlet opening configured to introduce the suspension into the mixing container a distributor element having a collecting container and an outlet arm fastened to the collecting container and a shaft with a longitudinal axis, wherein the shaft and the distributor element are arranged inside the mixing container, wherein the distributor element is mounted so as to be freely rotatable around the shaft, wherein the collecting container comprises a collecting opening configured to pass the suspension from the inlet opening into the distributor element, wherein the outlet arm comprises an outflow opening configured to let the suspension leave the distributor element, and wherein the outlet arm is designed such that the suspension is able to flow out of the distributor element starting from the collecting container via the outlet arm and the outflow opening, a flow of the suspension causing a torque on the distributor element so that the torque supports a rotation around the shaft.
-
公开(公告)号：US10276748B2
公开(公告)日：2019-04-30
申请号：US15514814
申请日：2015-10-07
发明人： Mathias Kaempf , Simon Jerebic , Ingo Neudecker , Guenter Spath , Michael Huber , Korbinian Perzlmaier
摘要： Disclosed is a radiation-emitting semi-conductor chip (1) comprising an epitaxial semi-conductor layer sequence (3) which emits electromagnetic radiation in operation. The epitaxial semi-conductor layer sequence (3) is applied on a a transparent substrate (4), wherein the substrate (4) has a first main surface (8) facing the semi-conductor layer sequence (3), a second main surface (9) facing away from the semi-conductor layer sequence (3) and a first lateral flank (10) arranged between the first main surface (8) and the second main surface (9), and the lateral flank (10) has a decoupling structure which is formed in a targeted manner from separating tracks. Also disclosed is a method for producing the semi-conductor chip, and a component comprising such a semi-conductor chip.
-
-
-
-
-
-
-
-
-
搜索结果
24 条记录 (耗时 0.019 秒)
